5 Pin Configuration and Functions

Figure 5-1 RTE Package16-Pin WQFN With Exposed Thermal PadTop View

Table 5-1 Pin Functions

PIN		I/O⁽¹⁾	DESCRIPTION
NAME	NO.	I/O⁽¹⁾	DESCRIPTION
AGND	5	—	Connect analog ground electrically to GND close to the device.
BOOT	13	O	The device requires a bootstrap capacitor between BOOT and PH. A voltage on this capacitor that is below the minimum required by the BOOT UVLO forces the output to switch off until the capacitor recharges.
COMP	7	O	Error amplifier output, and input to the output-switch current comparator. Connect frequency-compensation components to this pin.
EN	15	I	Enable pin, internal pullup-current source. Pull below 1.2 V to disable. Float to enable. One can use this pin to set the on-off threshold (adjust UVLO) with two additional resistors.
GND	3	—	Power ground. Directly connect this pin electrically to the thermal pad under the device.
GND	4	—
PH	10	O	The source of the internal high-side power MOSFET, and drain of the internal low-side (synchronous) rectifier MOSFET
	11
	12
PWRGD	14	O	An open-drain output; asserted low if output voltage is low due to thermal shutdown, overcurrent, over- or undervoltage, or EN shutdown.
RT/CLK	8	I	Resistor-timing or external-clock input pin
SS/TR	9	I	Slow start and tracking. An external capacitor connected to this pin sets the output-voltage rise time. Another use of this pin is for tracking.
VIN	1	I	Input supply voltage, 2.95 V to 6 V
	2
	16
VSENSE	6	I	Inverting node of the transconductance (g_m) error amplifier
Thermal pad		—	Connect the GND pin to the exposed thermal pad for proper operation. Connect this thermal pad to any internal PCB ground planes using multiple vias for good thermal performance.

(1) I = input, O = output