ZHCSG52B
March 2017 – May 2018
TPS543C20
PRODUCTION DATA.
1
特性
2
应用
3
说明
Device Images
简化原理图
4
修订历史记录
5
Device Comparison Table
6
Pin Configuration and Functions
Pin Functions
7
Specifications
7.1
Absolute Maximum Ratings
7.2
ESD Ratings
7.3
Recommended Operating Conditions
7.4
Thermal Information
7.5
Electrical Characteristics
7.6
Typical Characteristics
8
Detailed Description
8.1
Overview
8.2
Functional Block Diagram
8.3
Feature Description
8.4
Device Functional Modes
8.4.1
Soft-Start Operation
8.4.2
Input and VDD Undervoltage Lockout (UVLO) Protection
8.4.3
Power Good and Enable
8.4.4
Voltage Reference
8.4.5
Prebiased Output Start-up
8.4.6
Internal Ramp Generator
8.4.6.1
Ramp Selections
8.4.7
Switching Frequency
8.4.8
Clock Sync Point Selection
8.4.9
Synchronization and Stackable Configuration
8.4.10
Dual-Phase Stackable Configurations
8.4.10.1
Configuration 1: Master Sync Out Clock-to-Slave
8.4.10.2
Configuration 2: Master and Slave Sync to External System Clock
8.4.11
Operation Mode
8.4.12
API/BODY Brake
8.4.13
Sense and Overcurrent Protection
8.4.13.1
Low-Side MOSFET Overcurrent Protection
8.4.13.2
High-Side MOSFET Overcurrent Protection
8.4.14
Output Overvoltage and Undervoltage Protection
8.4.15
Overtemperature Protection
8.4.16
RSP/RSN Remote Sense Function
8.4.17
Current Sharing
8.4.18
Loss of Synchronization
9
Application and Implementation
9.1
Application Information
9.2
Typical Application: TPS543C20 Stand-alone Device
9.2.1
Design Requirements
9.2.2
Detailed Design Procedure
9.2.2.1
Custom Design With WEBENCH® Tools
9.2.2.2
Switching Frequency Selection
9.2.2.3
Inductor Selection
9.2.2.4
Input Capacitor Selection
9.2.2.5
Bootstrap Capacitor Selection
9.2.2.6
BP Pin
9.2.2.7
R-C Snubber and VIN Pin High-Frequency Bypass
9.2.2.8
Output Capacitor Selection
9.2.2.8.1
Response to a Load Transient
9.2.2.8.2
Ramp Selection Design to Ensure Stability
9.2.3
Application Curves
9.3
System Example
9.3.1
Two-Phase Stackable
9.3.1.1
Application Curves
10
Power Supply Recommendations
11
Layout
11.1
Layout Guidelines
11.2
Layout Example
11.3
Package Size, Efficiency and Thermal Performance
12
器件和文档支持
12.1
器件支持
12.1.1
开发支持
12.1.1.1
使用 WEBENCH® 工具创建定制设计
12.1.2
文档支持
12.1.2.1
相关文档
12.2
接收文档更新通知
12.3
社区资源
12.4
商标
12.5
静电放电警告
12.6
术语表
13
机械、封装和可订购信息
封装选项
机械数据 (封装 | 引脚)
RVF|40
MPQF268C
散热焊盘机械数据 (封装 | 引脚)
RVF|40
QFND333E
订购信息
zhcsg52b_oa
zhcsg52b_pm
9.3.1.1
Application Curves
Figure 33.
Transient Response of 0.9-V Output at 12 V
IN
, Transient is 25 A to 50 A, Step is 25 A at 30 A/μs
Figure 35.
Transient Response of 50-A to 25-A Load
at 30 A/μs Fall
Figure 37.
Output Ripple and SW Node
of 0.9-V Output at 12 VIN, 0-A Output
Figure 39.
0.6-V Pre-Bias Start Up From Enable,
0.9-V Output at 12 VIN, 0-A Output
Figure 41.
Master-Slave 180° Synchronization
Figure 34.
Transient Response of 25-A to 50-A Load
at 30 A/μs Rise
Figure 36.
Output Ripple and SW Node
of 0.9-V Output at 12 V
IN
,
80
-A Output
Figure 38.
Start up from Enable,
0.9-V Output at 12 VIN,
80
-A Output
Figure 40.
Output Voltage Start-up and Shutdown,
0.9-V Output at 12 VIN, 5-A Output
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