ZHCSCI5B May   2014  – July 2016 TPS544B20 , TPS544C20

PRODUCTION DATA.  

  1. 特性
  2. 应用范围
  3. 说明
  4. 修订历史记录
  5. Device Comparison Table
  6. Pin Configuration and Functions
  7. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Switching Characteristics
    7. 7.7 Typical Characteristics
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Turn-On and Turn-Off Delay and Sequencing
      2. 8.3.2  Pre-Biased Output Start-Up
      3. 8.3.3  Voltage Reference
      4. 8.3.4  Differential Remote Sense and Output Voltage Setting
      5. 8.3.5  PMBus Output Voltage Adjustment
      6. 8.3.6  Switching Frequency
      7. 8.3.7  Soft-Start
      8. 8.3.8  Linear Regulators BP3 and BP6
      9. 8.3.9  External Bypass (BPEXT)
      10. 8.3.10 Current Monitoring and Low-Side MOSFET Overcurrent Protection
      11. 8.3.11 High-Side MOSFET Short-Circuit Protection
      12. 8.3.12 Over-Temperature Protection
      13. 8.3.13 Input Undervoltage Lockout (UVLO)
      14. 8.3.14 Output Overvoltage and Undervoltage Protection
      15. 8.3.15 Fault Protection Responses
      16. 8.3.16 PMBus General Description
      17. 8.3.17 PMBus Address
      18. 8.3.18 PMBus Connections
      19. 8.3.19 Auto ARA (Alert Response Address) Response
    4. 8.4 Device Functional Modes
      1. 8.4.1 Continuous Conduction Mode
      2. 8.4.2 Operation with Internal BP6 Regulator
      3. 8.4.3 Operation with BP External
      4. 8.4.4 Operation with CNTL Signal Control
      5. 8.4.5 Operation with OPERATION Control
      6. 8.4.6 Operation with CNTL and OPERATION Control
      7. 8.4.7 Operation with Output Margining
    5. 8.5 Programming
      1. 8.5.1 Supported PMBus Commands
    6. 8.6 Register Maps
      1. 8.6.1  OPERATION (01h)
        1. 8.6.1.1 On
        2. 8.6.1.2 Margin
      2. 8.6.2  ON_OFF_CONFIG (02h)
        1. 8.6.2.1 pu
        2. 8.6.2.2 cmd
        3. 8.6.2.3 cpr
        4. 8.6.2.4 pol
        5. 8.6.2.5 cpa
      3. 8.6.3  CLEAR_FAULTS (03h)
      4. 8.6.4  WRITE_PROTECT (10h)
        1. 8.6.4.1 bit5
        2. 8.6.4.2 bit6
        3. 8.6.4.3 bit7
      5. 8.6.5  STORE_USER_ALL (15h)
      6. 8.6.6  RESTORE_USER_ALL (16h)
      7. 8.6.7  CAPABILITY (19h)
      8. 8.6.8  VOUT_MODE (20h)
        1. 8.6.8.1 Mode:
        2. 8.6.8.2 Exponent
      9. 8.6.9  VIN_ON (35h)
        1. 8.6.9.1 Exponent
        2. 8.6.9.2 Mantissa
      10. 8.6.10 VIN_OFF (36h)
        1. 8.6.10.1 Exponent
        2. 8.6.10.2 Mantissa
      11. 8.6.11 IOUT_CAL_OFFSET (39h)
        1. 8.6.11.1 Exponent
        2. 8.6.11.2 Mantissa
      12. 8.6.12 IOUT_OC_FAULT_LIMIT (46h)
        1. 8.6.12.1 Exponent
        2. 8.6.12.2 Mantissa
      13. 8.6.13 IOUT_OC_FAULT_RESPONSE (47h)
        1. 8.6.13.1 RS[2:0]
      14. 8.6.14 IOUT_OC_WARN_LIMIT (4Ah)
        1. 8.6.14.1 Exponent
        2. 8.6.14.2 Mantissa
      15. 8.6.15 OT_FAULT_LIMIT (4Fh)
        1. 8.6.15.1 Exponent
        2. 8.6.15.2 Mantissa
      16. 8.6.16 OT_WARN_LIMIT (51h)
        1. 8.6.16.1 Exponent
        2. 8.6.16.2 Mantissa
      17. 8.6.17 TON_RISE (61h)
        1. 8.6.17.1 Exponent
        2. 8.6.17.2 Mantissa
      18. 8.6.18 STATUS_BYTE (78h)
      19. 8.6.19 STATUS_WORD (79h)
      20. 8.6.20 STATUS_VOUT (7Ah)
      21. 8.6.21 STATUS_IOUT (7Bh)
      22. 8.6.22 STATUS_TEMPERATURE (7Dh)
      23. 8.6.23 STATUS_CML (7Eh)
      24. 8.6.24 STATUS_MFR_SPECIFIC (80h)
      25. 8.6.25 READ_VOUT (8Bh)
      26. 8.6.26 READ_IOUT (8Ch)
        1. 8.6.26.1 Exponent
        2. 8.6.26.2 Mantissa
      27. 8.6.27 READ_TEMPERATURE_2 (8Eh)
        1. 8.6.27.1 Exponent
        2. 8.6.27.2 Mantissa
      28. 8.6.28 PMBUS_REVISION (98h)
      29. 8.6.29 MFR_SPECIFIC_00 (D0h)
      30. 8.6.30 VREF_TRIM (MFR_SPECIFIC_04) (D4h)
      31. 8.6.31 STEP_VREF_MARGIN_HIGH (MFR_SPECIFIC_05) (D5h)
      32. 8.6.32 STEP_VREF_MARGIN_LOW (MFR_SPECIFIC_06) (D6h)
      33. 8.6.33 PCT_VOUT_FAULT_PG_LIMIT (MFR_SPECIFIC_07) (D7h)
      34. 8.6.34 SEQUENCE_TON_TOFF_DELAY (MFR_SPECIFIC_08) (D8h)
      35. 8.6.35 OPTIONS (MFR_SPECIFIC_21) (E5h)
      36. 8.6.36 MASK_SMBALERT (MFR_SPECIFIC_23) (E7h)
        1. 8.6.36.1  mOTFI
        2. 8.6.36.2  mPRTCL
        3. 8.6.36.3  mSMBTO
        4. 8.6.36.4  mIVC
        5. 8.6.36.5  mIVD
        6. 8.6.36.6  mPEC
        7. 8.6.36.7  mMEM
        8. 8.6.36.8  Auto_ARA
        9. 8.6.36.9  mOTF
        10. 8.6.36.10 mOTW
        11. 8.6.36.11 mOCF
        12. 8.6.36.12 mOCW
        13. 8.6.36.13 mOVF
        14. 8.6.36.14 mUVF
        15. 8.6.36.15 mPGOOD
        16. 8.6.36.16 mVIN_UV
      37. 8.6.37 DEVICE_CODE (MFR_SPECIFIC_44) (FCh)
  9. Applications and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1  Switching Frequency Selection
        2. 9.2.2.2  Inductor Selection
        3. 9.2.2.3  Output Capacitor Selection
          1. 9.2.2.3.1 Response to a Load Transition
          2. 9.2.2.3.2 Output Voltage Ripple
        4. 9.2.2.4  D-CAP Mode and D-CAP2 Mode Stability
        5. 9.2.2.5  Input Capacitor Selection
        6. 9.2.2.6  Bootstrap Capacitor and Resistor Selection
        7. 9.2.2.7  BP6, BP3 and BPEXT
        8. 9.2.2.8  R-C Snubber and VIN Pin High-Frequency Bypass
        9. 9.2.2.9  Temperature Sensor
        10. 9.2.2.10 Key PMBus Parameter Selection
          1. 9.2.2.10.1 Enable, UVLO and Sequencing
          2. 9.2.2.10.2 Soft-Start Time
          3. 9.2.2.10.3 Overcurrent Threshold and Response
          4. 9.2.2.10.4 Power Good, Output Overvoltage and Undervoltage Protection
        11. 9.2.2.11 Output Voltage Setting and Frequency Compensation Selection
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
      1. 11.2.1 Mounting and Thermal Profile Recommendation
  12. 12器件和文档支持
    1. 12.1 器件支持
      1. 12.1.1 开发支持
        1. 12.1.1.1 米6体育平台手机版_好二三四 (TI) Fusion Digital Power设计人员
      2. 12.1.2 器件命名规则
    2. 12.2 相关链接
    3. 12.3 商标
    4. 12.4 接收文档更新通知
    5. 12.5 社区资源
    6. 12.6 静电放电警告
    7. 12.7 Glossary
  13. 13机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

Pin Configuration and Functions

RVF Package
40-Pin LQFN with Thermal Tab
(TOP VIEW)
TPS544B20 TPS544C20 dev_SLUS69B_pinout.gif

Pin Functions

PIN I/O(1) DESCRIPTION
NAME NO.
ADDR0 3 O Sets low order 3-bits of the PMBus address. Connect a resistor from this pin to AGND.
ADDR1 2 O Sets high order 3-bits of the PMBus address. Connect a resistor from this pin to AGND.
AGNDSNS 13 G Analog ground sense. Provides Kelvin connection point to analog ground for precise current measurement. AGNDSNS is internally connected to the thermal tab. Do not connect to the thermal tab externally. Kelvin connect back to AGND pin with a low impedance, low noise path. This kelvin connection serves as the only connection between AGND and GND.
AGND 38 G Analog ground return for control circuitry. AGND should not be connected to the exposed thermal pad, GND or PGND, but should be Kelvin connected to the AGNDSNS pin.
BP3 27 S Output of the 3.3-V on-board regulator. This regulator powers the controller and should be bypassed with a minimum of 100-nF capacitor to AGND.
BP6 28 S Output of the 6-V on-board regulator. This regulator powers the driver stage of the controller and should be bypassed with a 4.7-µF ceramic capacitor to GND.
BOOT 7 S Bootstrap pin for the internal flying high-side driver. Connect a typical 100-nF capacitor from this pin to the SW pins.
BPEXT 30 I External BP voltage for BP crossover function. Bypass with a 4.7-µF ceramic capacitor to GND if used.. Connect to GND if not used.
CLK 5 I PMBus CLK pin. See PMBus specification.
CNTL 1 I PMBus CNTL pin. See PMBus specification.
COMP 35 O Output of the error amplifier. This regulates the D-CAP and D-CAP2 valley voltage reference for output regulation and should be bypassed with a 10-nF capacitor to AGND.
DATA 4 I/O PMBus DATA pin. See PMBus specification.
DIFFO 33 O Output of the differential sense amplifier.
FB 34 I Feedback pin for the control loop. Regulates to a nominal 600 mV if there is no trim applied to the device using VREF_TRIM.
GND 14 G Power stage ground return.
15
16
17
18
19
20
PGND 26 G Power ground return for controller device. Connect to GND at the thermal tab with a minimum 8 mil wide PCB trace
PGOOD 36 O Power good output. Open drain output that floats up when the device is operating and in regulation. Any fault condition causes this pin to pull low.
RT 40 O Frequency-setting resistor. Connect a resistor from this pin to AGND to program the switching frequency.
SMBALERT 6 O SMBus alert pin. See SMBus specification.
SW 8 O Switched power output of the device. Connect the output averaging filter and bootstrap capacitor to this group of pins.
9
10
11
12
MODE 39 I D-CAP and D-CAP2 control mode selection pin. Connect to BP3 for D-CAP2 mode control. Connect to AGND for D-CAP mode control.
TSNS 37 O External temperature sense signal input. TSNS can be connected to AGND to disable external temperature measurement.
VDD 29 I Input Voltage for analog control circuitry. Bypass with a 0.1-µF to 1.0-µF capacitor to GND (thermal pad or GND pins) or through a dedicated connection to AGNDSNS. The VDD voltage is also used for input feed-forward, ON-time generation and High Side Over Current (HSOC). VIN and VDD must be at the same voltage for accurate short circuit protection.
VIN 21 I Input power to the power stage. Bypass High-Frequency bypassing with multiple ceramic capacitors to GND is critical. See Layout Recommendations
22
23
24
25
VOUTS+ 31 I Output voltage sensing, positive side. This sensing provides remote sensing for PMBus reporting and the voltage control loop. Connect to VOUT at desried regulation point through < 100-Ω resistor. Route with GND to VOUT- using coupled differential pair PCB routing.
VOUTS– 32 I Output voltage sensing, negative or common side. This sensing provides remote sensing for PMBus reporting and the voltage control loop. Connect to Ground at desried regulation point through < 100-Ω resistor. Route with VOUT to VOUT+ using coupled differential pair PCB routing.
Thermal tab Package thermal tab. Connect to GND. The thermal tab must have adequate solder coverage for proper operation.
I = Input, O = Output, P = Supply, G = Ground