Input capacitors must be selected to provide reduction in input voltage ripple and high-frequency bypassing, which in return will reduce switching stress on the power stage MOSFETs internal to the device. In this example, a 0.1-µF, 25-V, 0402 must be placed as close as possible to pin 20 of the device on the same layer as the IC on the PCB. In addition, 6x 10-µF ceramic capacitors are used and a 270-µF bulk capacitor is used on the input.