(1) Maximum power dissipation may be limited by overcurrent protection.

(2) Power rating at a specific ambient temperature T_A should be determined with a junction temperature of 125°C. This is the point where distortion starts to substantially increase. Thermal management of the final PCB should strive to keep the junction temperature at or below 125°C for best performance and long-term reliability. See Thermal Calculations in applications section of this data sheet for more information.

(3) Test board conditions:

1. 2 in x 1.85 in, 4 layers, 0.062-in (1,57-mm) thickness
2. 2-oz copper traces located on the top and bottom of the PCB
3. 2-oz copper ground planes on the two internal layers
4. Four thermal vias in the PowerPAD area under the device package