ZHCS920B May   2012  – April 2021 TPS54525

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  PWM Operation
      2. 7.3.2  PWM Frequency and Adaptive On-Time Control
      3. 7.3.3  Soft Start and Pre-Biased Soft Start
      4. 7.3.4  Power Good
      5. 7.3.5  VREG5
      6. 7.3.6  Output Discharge Control
      7. 7.3.7  Current Protection
      8. 7.3.8  Over/Under Voltage Protection
      9. 7.3.9  UVLO Protection
      10. 7.3.10 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Forced CCM Mode
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Step By Step Design Procedure
        2. 8.2.2.2 Output Voltage Resistors Selection
        3. 8.2.2.3 Output Filter Selection
        4. 8.2.2.4 Input Capacitor Selection
        5. 8.2.2.5 Bootstrap Capacitor Selection
        6. 8.2.2.6 VREG5 Capacitor Selection
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Guidelines
      1. 10.2.1 Thermal Considerations
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 第三方米6体育平台手机版_好二三四免责声明
    2. 11.2 接收文档更新通知
    3. 11.3 支持资源
    4. 11.4 Trademarks
    5. 11.5 静电放电警告
    6. 11.6 术语表

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

6.4 Thermal Information

THERMAL METRIC(1)TPS54525UNITS
PWP
14 PINS
θJAJunction-to-ambient thermal resistance43.7°C/W
θJCtopJunction-to-case (top) thermal resistance33.1
θJBJunction-to-board thermal resistance28.4
ψJTJunction-to-top characterization parameter1.3
ψJBJunction-to-board characterization parameter28.2
θJCbotJunction-to-case (bottom) thermal resistance4.7
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