ZHCSB15B
May 2013 – October 2023
TPS54531
PRODUCTION DATA
1
1
特性
2
应用
3
说明
4
Revision History
5
Pin Configuration and Functions
6
Specifications
6.1
Absolute Maximum Ratings
6.2
ESD Ratings
6.3
Recommended Operating Conditions
6.4
Thermal Information
6.5
Electrical Characteristics
6.6
Typical Characteristics
7
Detailed Description
7.1
Overview
7.2
Functional Block Diagram
7.3
Feature Description
7.3.1
Fixed-Frequency PWM Control
7.3.2
Voltage Reference (Vref)
7.3.3
Bootstrap Voltage (BOOT)
7.3.4
Enable and Adjustable Input Undervoltage Lockout (VIN UVLO)
7.3.5
Programmable Slow Start Using SS Pin
7.3.6
Error Amplifier
7.3.7
Slope Compensation
7.3.8
Current-Mode Compensation Design
7.3.9
Overcurrent Protection and Frequency Shift
7.3.10
Overvoltage Transient Protection
7.3.11
Thermal Shutdown
7.4
Device Functional Modes
7.4.1
Eco-mode
7.4.2
Operation With VIN < 3.5 V
7.4.3
Operation With EN Control
8
Application and Implementation
8.1
Application Information
8.2
Typical Application
8.2.1
Design Requirements
8.2.2
Detailed Design Procedure
8.2.2.1
Custom Design With WEBENCH® Tools
8.2.2.2
Switching Frequency
8.2.2.3
Output Voltage Set Point
8.2.2.4
Undervoltage Lockout Set Point
8.2.2.5
Input Capacitors
8.2.2.6
Output Filter Components
8.2.2.6.1
Inductor Selection
8.2.2.6.2
Capacitor Selection
8.2.2.7
Compensation Components
8.2.2.8
Bootstrap Capacitor
8.2.2.9
Catch Diode
8.2.2.10
Slow-Start Capacitor
8.2.2.11
Output Voltage Limitations
8.2.2.12
Power Dissipation Estimate
8.2.3
Application Curves
8.3
Power Supply Recommendations
8.4
Layout
8.4.1
Layout Guidelines
8.4.2
Layout Example
8.4.3
Electromagnetic Interference (EMI) Considerations
9
Device and Documentation Support
9.1
Device Support
9.1.1
Development Support
9.1.1.1
Custom Design With WEBENCH® Tools
9.2
接收文档更新通知
9.3
支持资源
9.4
Trademarks
9.5
静电放电警告
9.6
术语表
10
Mechanical, Packaging, and Orderable Information
封装选项
机械数据 (封装 | 引脚)
DDA|8
MPDS092F
散热焊盘机械数据 (封装 | 引脚)
DDA|8
PPTD058I
订购信息
zhcsb15b_oa
zhcsb15b_pm
9.5
静电放电警告
静电放电 (ESD) 会损坏这个集成电路。米6体育平台手机版_好二三四 (TI) 建议通过适当的预防措施处理所有集成电路。如果不遵守正确的处理和安装程序,可能会损坏集成电路。
ESD 的损坏小至导致微小的性能降级,大至整个器件故障。精密的集成电路可能更容易受到损坏,这是因为非常细微的参数更改都可能会导致器件与其发布的规格不相符。
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