ZHCSJK9H June   2001  – October 2015 TPS54610

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
    1.     Device Images
      1.      简化原理图
      2.      在 350 kHz 时的效率
  4. 4 修订历史记录
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Dissipation Ratings
    7. 7.7 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Undervoltage Lockout (UVLO)
      2. 8.3.2  Slow Start/Enable (SS/ENA)
      3. 8.3.3  VBIAS Regulator (VBIAS)
      4. 8.3.4  Voltage Reference
      5. 8.3.5  Oscillator and PWM Ramp
      6. 8.3.6  Error Amplifier
      7. 8.3.7  PWM Control
      8. 8.3.8  Dead-Time Control and MOSFET Drivers
      9. 8.3.9  Overcurrent Protection
      10. 8.3.10 Thermal Shutdown
      11. 8.3.11 Power-Good (PWRGD)
    4. 8.4 Device Functional Modes
      1. 8.4.1 Continuous Conduction Mode
      2. 8.4.2 Switching Frequency Selection/Synchronization
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 High Frequency Switching Regulator Using Ceramic Output Capacitors
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
          1. 9.2.1.2.1 Component Selection
          2. 9.2.1.2.2 Input Filter
          3. 9.2.1.2.3 Feedback Circuit
          4. 9.2.1.2.4 Operating Frequency
          5. 9.2.1.2.5 Output Filter
        3. 9.2.1.3 Application Curves
      2. 9.2.2 High Frequency Application
        1. 9.2.2.1 Design Requirements
        2. 9.2.2.2 Detailed Design Procedure
        3. 9.2.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
    3. 11.3 Thermal Considerations
  12. 12器件和文档支持
    1. 12.1 器件支持
      1. 12.1.1 相关直流/直流米6体育平台手机版_好二三四
    2. 12.2 接收文档更新通知
    3. 12.3 社区资源
    4. 12.4 商标
    5. 12.5 静电放电警告
    6. 12.6 术语表
  13. 13机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

7.4 Thermal Information

THERMAL METRIC(1) TPS54610 UNIT
PWP (HTSSOP)
28 PINS
RθJA Junction-to-ambient thermal resistance 31.0 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 28.3 °C/W
RθJB Junction-to-board thermal resistance 15.1 °C/W
ψJT Junction-to-top characterization parameter 0.7 °C/W
ψJB Junction-to-board characterization parameter 7.0 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.
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