ZHCSLU7A September   2020  – August 2021 TPS54618C-Q1

PRODUCTION DATA  

  1. 特性
  2. 应用
  3. 说明
  4. Revision History
  5. Pin Configuration and Functions
    1.     Pin Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Fixed Frequency PWM Control
      2. 7.3.2  Slope Compensation and Output Current
      3. 7.3.3  Bootstrap Voltage (Boot) and Low Dropout Operation
      4. 7.3.4  Error Amplifier
      5. 7.3.5  Voltage Reference
      6. 7.3.6  Adjusting the Output Voltage
      7. 7.3.7  Enable and Adjusting Undervoltage Lockout
      8. 7.3.8  Soft-Start Pin
      9. 7.3.9  Sequencing
      10. 7.3.10 Constant Switching Frequency and Timing Resistor (RT/CLK Pin)
      11. 7.3.11 Overcurrent Protection
      12. 7.3.12 Frequency Shift
      13. 7.3.13 Reverse Overcurrent Protection
      14. 7.3.14 Synchronize Using the RT/CLK Pin
      15. 7.3.15 Power Good (PWRGD Pin)
      16. 7.3.16 Overvoltage Transient Protection
      17. 7.3.17 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Simple Small Signal Model for Peak Current Mode Control
      2. 7.4.2 Small Signal Model for Frequency Compensation
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Step One: Select the Switching Frequency
        2. 8.2.2.2 Step Two: Select the Output Inductor
        3. 8.2.2.3 Step Three: Choose the Output Capacitor
        4. 8.2.2.4 Step Four: Select the Input Capacitor
        5. 8.2.2.5 Step Five: Choose the Soft-Start Capacitor
        6. 8.2.2.6 Step Six: Select the Bootstrap Capacitor
        7. 8.2.2.7 Step Eight: Select Output Voltage and Feedback Resistors
          1. 8.2.2.7.1 Output Voltage Limitations
        8. 8.2.2.8 Step Nine: Select Loop Compensation Components
      3. 8.2.3 Application Curves
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 Power Dissipation Estimate
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Developmental Support
    2. 11.2 接收文档更新通知
    3. 11.3 支持资源
    4. 11.4 Trademarks
    5. 11.5 静电放电警告
    6. 11.6 术语表
  12. 12Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
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订购信息

Pin Functions

PIN TYPE(1) DESCRIPTION
NAME NO.
AGND 5 G Analog ground must be electrically connected to GND close to the device.
BOOT 13 I A bootstrap capacitor is required between BOOT and PH. If the voltage on this capacitor is below the minimum required by the BOOT UVLO, the output is forced to switch off until the capacitor is refreshed.
COMP 7 O Error amplifier output, and input to the output switch current comparator. Connect frequency compensation components to this pin.
EN 15 I Enable pin and internal pullup current source. Pull below 1.2 V to disable. Float to enable. Can be used to set the on/off threshold (adjust UVLO) with two additional resistors.
GND 3 G Power ground. This pin must be electrically connected directly to the power pad under the device.
4
PH 10 O The source of the internal high-side power MOSFET, and drain of the internal low-side (synchronous) rectifier MOSFET.
11
12
PWRGD 14 O An open-drain output, asserts low if output voltage is low due to thermal shutdown, overcurrent, overvoltage and undervoltage, or EN shutdown.
RT/CLK 8 I/O Resistor timing or external clock input pin
SS/TR 9 I/O Slow start and tracking. An external capacitor connected to this pin sets the output voltage rise time. This pin can also be used for tracking.
VIN 1 I Input supply voltage: 2.95 V to 6 V
2
16
VSENSE 6 I Inverting node of the transconductance (gm) error amplifier
Thermal Pad G GND pin must be connected to the exposed power pad for proper operation. This power pad must be connected to any internal PCB ground plane using multiple vias for good thermal performance.
I = Input, O = Output, G = Ground