| THERMAL METRIC(1)
(2)
|
TPS54622-EP |
UNIT |
| RHL (VQFN) |
| 14 PINS |
| RθJA
|
Junction-to-ambient thermal resistance |
47.2 |
°C/W |
| RθJA
|
Junction-to-ambient thermal resistance (3)
|
32 |
°C/W |
| RθJCtop
|
Junction-to-case (top) thermal resistance |
64.8 |
°C/W |
| RθJB
|
Junction-to-board thermal resistance |
14.4 |
°C/W |
| ψJT
|
Junction-to-top characterization parameter |
0.5 |
°C/W |
| ψJB
|
Junction-to-board characterization parameter |
14.7 |
°C/W |
| RθJCbot
|
Junction-to-case (bottom) thermal resistance |
3.2 |
°C/W |
(1) For more information about traditional and new thermal metrics, see the
Semiconductor and IC Package Thermal Metrics application report,
SPRA953.
(2) Power rating at a specific ambient temperature TA should be determined with a junction temperature of 150°C. This is the point where distortion starts to substantially increase. Thermal management of the PCB should strive to keep the junction temperature at or below 150°C for best performance and long-term reliability. See the power dissipation estimate in the application section of this datasheet for more information.
(3) Test Board Conditions:
- 2.5 inches × 2.5 inches, 4 layers, thickness: 0.062 inch
- 2 oz. copper traces located on the top of the PCB
- 2 oz. copper ground planes on the 2 internal layers of and the bottom layer
- 4 0.010 inch thermal vias located under the device package