ZHCSFG4B July   2016  – November 2016 TPS546C23

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用范围
  3. 3 说明
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  2-Phase Application
      2. 7.3.2  Linear Regulators BP3 and BP6
      3. 7.3.3  Input Undervoltage Lockout (UVLO)
      4. 7.3.4  Turnon and Turnoff Delay and Sequencing
      5. 7.3.5  Voltage Reference
      6. 7.3.6  Differential Remote Sense and Compensation
      7. 7.3.7  Set Output Voltage and Adaptive Voltage Scaling (AVS)
        1. 7.3.7.1 VOUT_COMMAND
        2. 7.3.7.2 VREF_TRIM
        3. 7.3.7.3 MARGIN
      8. 7.3.8  Reset VOUT
      9. 7.3.9  Switching Frequency and Synchronization
        1. 7.3.9.1 Synchronization
          1. 7.3.9.1.1 Stand-Alone Device
          2. 7.3.9.1.2 Master-Slave Configuration
          3. 7.3.9.1.3 SYNC Fault
      10. 7.3.10 Current Sharing
      11. 7.3.11 Soft-Start Time and TON_RISE Command
      12. 7.3.12 Prebiased Output Start-Up
      13. 7.3.13 Soft-Stop time and TOFF_FALL Command
      14. 7.3.14 Output Current Telemetry and Low-Side MOSFET Overcurrent Protection
        1. 7.3.14.1 Output Current Telemetry
        2. 7.3.14.2 Low-Side MOSFET Overcurrent Protection
        3. 7.3.14.3 Negative Overcurrent Protection
      15. 7.3.15 High-Side MOSFET Short-Circuit Protection
      16. 7.3.16 Die Temperature Telemetry and Overtemperature Protection
      17. 7.3.17 Output Voltage Telemetry and Over-/Under-voltage Protection
        1. 7.3.17.1 Output Voltage Telemetry
        2. 7.3.17.2 Output Overvoltage and Undervoltage Protection
      18. 7.3.18 TON_MAX Fault
      19. 7.3.19 Power Good (PGOOD) Indicator
      20. 7.3.20 Fault Protection Responses
      21. 7.3.21 Switching Node
      22. 7.3.22 PMBus General Description
      23. 7.3.23 PMBus Address
      24. 7.3.24 PMBus Connections
      25. 7.3.25 Auto ARA (Alert Response Address) Response
    4. 7.4 Device Functional Modes
      1. 7.4.1 Continuous Conduction Mode
      2. 7.4.2 Operation with CNTL Signal Control
      3. 7.4.3 Operation with OPERATION Control
      4. 7.4.4 Operation with CNTL and OPERATION Control
    5. 7.5 Programming
      1. 7.5.1 Supported PMBus Commands
    6. 7.6 Register Maps
      1. 7.6.1  OPERATION (01h)
        1. 7.6.1.1 On Bit
        2. 7.6.1.2 Off Bit
        3. 7.6.1.3 Margin Bit
      2. 7.6.2  ON_OFF_CONFIG (02h)
        1. 7.6.2.1 pu Bit
        2. 7.6.2.2 cmd Bit
        3. 7.6.2.3 cpr Bit
        4. 7.6.2.4 pol Bit
        5. 7.6.2.5 cpa Bit
      3. 7.6.3  CLEAR_FAULTS (03h)
      4. 7.6.4  WRITE_PROTECT (10h)
        1. 7.6.4.1 bit5
        2. 7.6.4.2 bit6
        3. 7.6.4.3 bit7
      5. 7.6.5  STORE_DEFAULT_ALL (11h)
      6. 7.6.6  RESTORE_DEFAULT_ALL (12h)
      7. 7.6.7  STORE_USER_ALL (11h)
      8. 7.6.8  RESTORE_USER_ALL (12h)
      9. 7.6.9  CAPABILITY (19h)
      10. 7.6.10 SMBALERT_MASK (1Bh)
      11. 7.6.11 VOUT_MODE (20h)
        1. 7.6.11.1 Mode Bit
        2. 7.6.11.2 Exponent Bit
      12. 7.6.12 VOUT_COMMAND (21h)
        1. 7.6.12.1 Exponent
        2. 7.6.12.2 Mantissa
      13. 7.6.13 VOUT_MAX (24h)
        1. 7.6.13.1 Exponent
        2. 7.6.13.2 Mantissa
      14. 7.6.14 VOUT_TRANSITION_RATE (27h)
        1. 7.6.14.1 Exponent
        2. 7.6.14.2 Mantissa
      15. 7.6.15 VOUT_SCALE_LOOP (29h)
        1. 7.6.15.1 Exponent
        2. 7.6.15.2 Mantissa
      16. 7.6.16 VOUT_MIN (2Bh)
        1. 7.6.16.1 Exponent
        2. 7.6.16.2 Mantissa
      17. 7.6.17 VIN_ON (35h)
        1. 7.6.17.1 Exponent
        2. 7.6.17.2 Mantissa
      18. 7.6.18 VIN_OFF (36h)
        1. 7.6.18.1 Exponent
        2. 7.6.18.2 Mantissa
      19. 7.6.19 IOUT_CAL_OFFSET (39h)
        1. 7.6.19.1 Exponent
        2. 7.6.19.2 Mantissa
      20. 7.6.20 VOUT_OV_FAULT_RESPONSE (41h)
        1. 7.6.20.1 RSP[1] Bit
        2. 7.6.20.2 RS[2:0] Bits
        3. 7.6.20.3 TD[2:0] Bits
      21. 7.6.21 VOUT_UV_FAULT_RESPONSE (45h)
        1. 7.6.21.1 RSP[1] Bit
        2. 7.6.21.2 RS[2:0] Bits
        3. 7.6.21.3 TD[2:0] Bits
      22. 7.6.22 IOUT_OC_FAULT_LIMIT (46h)
        1. 7.6.22.1 Exponent
        2. 7.6.22.2 Mantissa
      23. 7.6.23 IOUT_OC_FAULT_RESPONSE (47h)
        1. 7.6.23.1 RSP[1:0] Bits
        2. 7.6.23.2 RS[2:0] Bits
        3. 7.6.23.3 TD[2:0] Bits
      24. 7.6.24 IOUT_OC_WARN_LIMIT (4Ah)
        1. 7.6.24.1 Exponent
        2. 7.6.24.2 Mantissa
      25. 7.6.25 OT_FAULT_LIMIT (4Fh)
        1. 7.6.25.1 Exponent
        2. 7.6.25.2 Mantissa
      26. 7.6.26 OT_FAULT_RESPONSE (50h)
        1. 7.6.26.1 RSP[1] Bit
        2. 7.6.26.2 RS[2:0] Bits
        3. 7.6.26.3 TD[2:0] Bits
      27. 7.6.27 OT_WARN_LIMIT (51h)
        1. 7.6.27.1 Exponent
        2. 7.6.27.2 Mantissa
      28. 7.6.28 TON_DELAY (60h)
        1. 7.6.28.1 Exponent
        2. 7.6.28.2 Mantissa
      29. 7.6.29 TON_RISE (61h)
        1. 7.6.29.1 Exponent
        2. 7.6.29.2 Mantissa
      30. 7.6.30 TON_MAX_FAULT_LIMIT (62h)
        1. 7.6.30.1 Exponent
        2. 7.6.30.2 Mantissa
      31. 7.6.31 TON_MAX_FAULT_RESPONSE (63h)
        1. 7.6.31.1 RSP[1] Bit
        2. 7.6.31.2 RS[2:0] Bits
        3. 7.6.31.3 TD[2:0] Bits
      32. 7.6.32 TOFF_DELAY (64h)
        1. 7.6.32.1 Exponent
        2. 7.6.32.2 Mantissa
      33. 7.6.33 TOFF_FALL (65h)
        1. 7.6.33.1 Exponent
        2. 7.6.33.2 Mantissa
      34. 7.6.34 STATUS_BYTE (78h)
      35. 7.6.35 STATUS_WORD (79h)
      36. 7.6.36 STATUS_VOUT (7Ah)
      37. 7.6.37 STATUS_IOUT (7Bh)
      38. 7.6.38 STATUS_INPUT (7Ch)
      39. 7.6.39 STATUS_TEMPERATURE (7Dh)
      40. 7.6.40 STATUS_CML (7Eh)
      41. 7.6.41 STATUS_MFR_SPECIFIC (80h)
      42. 7.6.42 READ_VOUT (8Bh)
        1. 7.6.42.1 Exponent
        2. 7.6.42.2 Mantissa
      43. 7.6.43 READ_IOUT (8Ch)
        1. 7.6.43.1 Exponent
        2. 7.6.43.2 Mantissa
      44. 7.6.44 READ_TEMPERATURE_1 (8Dh)
        1. 7.6.44.1 Exponent
        2. 7.6.44.2 Mantissa
      45. 7.6.45 PMBUS_REVISION (98h)
      46. 7.6.46 IC_DEVICE_ID (ADh)
      47. 7.6.47 IC_DEVICE_REV (AEh)
      48. 7.6.48 MFR_SPECIFIC_00 (D0h)
      49. 7.6.49 VREF_TRIM (MFR_SPECIFIC_04) (D4h)
      50. 7.6.50 STEP_VREF_MARGIN_HIGH (MFR_SPECIFIC_05) (D5h)
      51. 7.6.51 STEP_VREF_MARGIN_LOW (MFR_SPECIFIC_06) (D6h)
      52. 7.6.52 PCT_OV_UV_WRN_FLT_LIMITS (MFR_SPECIFIC_07) (D7h)
      53. 7.6.53 OPTIONS (MFR_SPECIFIC_21) (E5h)
        1. 7.6.53.1  DIS_NEGILIM Bit
        2. 7.6.53.2  EN_RESET_B Bit
        3. 7.6.53.3  EN_ADC_CNTL Bit
        4. 7.6.53.4  VSM Bit
        5. 7.6.53.5  DLO Bit
        6. 7.6.53.6  AVG_PROG[1:0] Bits
        7. 7.6.53.7  EN_AUTO_ARA Bit
        8. 7.6.53.8  READ_VOUT_RANGE[1:0] Bits
        9. 7.6.53.9  RST_VOUT_oSD Bit
        10. 7.6.53.10 RSMLO_VAL Bit
        11. 7.6.53.11 RSMHI_VAL Bit
      54. 7.6.54 MISC_CONFIG_OPTIONS (MFR_SPECIFIC_32) (F0h)
        1. 7.6.54.1 OV_RESP_SEL Bit
        2. 7.6.54.2 HSOC_USER_TRIM[1:0] Bits
        3. 7.6.54.3 EN_AVS_USER Bit
        4. 7.6.54.4 FORCE_SYNC_OUT Bit
        5. 7.6.54.5 FORCE_SYNC_IN Bit
        6. 7.6.54.6 SYNC_FAULT_DIS Bit
  8. 8 Applications and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 4.5-V to 18-V Input, 1-V Typical Output, 35-A Converter
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1  Switching Frequency Selection
          2. 8.2.1.2.2  Inductor Selection
          3. 8.2.1.2.3  Output Capacitor Selection
          4. 8.2.1.2.4  Output Voltage Deviation During Load Transient
          5. 8.2.1.2.5  Output Voltage Ripple
          6. 8.2.1.2.6  Input Capacitor Selection
          7. 8.2.1.2.7  AVIN, BP6, BP3 Bypass Capacitor
          8. 8.2.1.2.8  Bootstrap Capacitor Selection
          9. 8.2.1.2.9  R-C Snubber
          10. 8.2.1.2.10 Output Voltage Setting and Frequency Compensation Selection
          11. 8.2.1.2.11 Key PMBus Parameter Selection
          12. 8.2.1.2.12 Enable, UVLO
          13. 8.2.1.2.13 Soft-Start Time
          14. 8.2.1.2.14 Overcurrent Threshold and Response
        3. 8.2.1.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 Mounting and Thermal Profile Recommendation
  11. 11器件和文档支持
    1. 11.1 开发支持
      1. 11.1.1 米6体育平台手机版_好二三四 (TI) Fusion Digital Power Designer
      2. 11.1.2 WEBENCH® 工具
    2. 11.2 接收文档更新通知
    3. 11.3 社区资源
    4. 11.4 商标
    5. 11.5 静电放电警告
    6. 11.6 Glossary
  12. 12机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

5 Pin Configuration and Functions

RVF Package
40-Pin LQFN With Exposed Thermal Pad
Top View

Pin Functions

PIN I/O DESCRIPTION
NAME NO.
ADDR0 3 I Sets low-order 3-bits of the PMBus address. Connect a resistor between this pin and AGND.
ADDR1 2 I Sets high-order 3-bits of the PMBus address. Connect a resistor between this pin and AGND.
AGND 38 — Analog ground return for controller device. Connect this pin to PGND and DRGND at the thermal pad.
AVIN 29 I Input power to the controller. Connect a low-impedance bypass with a minimum of 1 µF to PGND. The AVIN voltage is also used for input feed-forward. PVIN and AVIN must be the same potential for accurate short circuit protection.
BP3 27 O Output of the 3.3-V onboard regulator. This regulator powers the controller and should be bypassed with a minimum of 2.2 µF to AGND. The BP3 pin is not designed to power external circuit.
BP6 28 O Output of the 6.5-V onboard regulator. This regulator powers the driver stage of the controller and should be bypassed with a minimum of 2.2 µF to the thermal pad (power-stage ground, essentially PGND). TI recommends using an additional 100-nF (typical) bypass capacitor for reducing ripple on BP6. The low-impedance bypassing of this pin to PGND is critical.
BOOT 7 I/O Bootstrap pin for the internal flying high-side driver. Connect a 100-nF (typical) capacitor from this pin to the SW pin. To reduce the voltage spike at SW, a BOOT resistor with a value between 1 Ω to 15 Ω can be placed in series with the BOOT capacitor to slow down turnon of the high-side FET.
CNTL 40 I PMBus CNTL pin. See the Supported PMBus Commands section. The CNTL pin has an internal pullup and floats high when left floating.
COMP 37 O Output of the error amplifier. Connect compensator network from this pin to the FB pin.
DIFFO 35 O Output of the differential remote sense amplifier. This provides remote sensing for output voltage reporting and the voltage control loop. For the loop slave device in a 2-phase configuration, the DIFFO pin can be left floating.
DRGND 26 — Power ground return for controller device. This pin should be directly connected to the thermal pad on the PCB board.
FB 36 I Feedback pin for the control loop. Negative input of the error amplifier. In 2-phase configuration, the FB pin of the loop slave device should be tied to the BP3 pin.
ISHARE 31 I/O Current sharing signal for 2-phase operation. For a stand-alone device, the ISHARE pin can be left floating.
PGND 13 — Power stage ground return. These pins are internally connected to the thermal pad.
14
15
16
17
18
19
20
PMB_CLK 5 I PMBus CLK pin. See the Supported PMBus Commands section.
PMB_DATA 4 I/O PMBus DATA pin. See the Supported PMBus Commands section.
PVIN 21 I Input power to the power stage. Low-impedance bypassing of these pins to PGND is critical.
22
23
24
25
RESET/PGD 30 I/O This pin is for the output voltage reset or the power-good output. The function of this pin is determined by the user-accessible bit, EN_RESET_B, in the MFR_SPECIFIC_21 (E4h) register. The default of this pin is for the power-good indicator. For output voltage reset, this pin is a logic-low input. An internal pulldown of 750 kΩ is present so this pin requires a pullup resistor to enable the programming of VOUT. As the power-good indicator, this pin is an open-drain output which floats up to external pullup when the device is operation and in regulation. During any fault or warn conditions, this pin is pulled low. For details see Table 2. The PGD pin can be left floating when not used.
RSP 33 I The positive input of the remote sense amplifier. For a stand-alone device or the loop master device in a 2-phase configuration, connect the RSP pin to the output voltage at the load. For the loop slave device in a 2-phase configuration, the remote sense amplifier is not required for output voltage sensing or regulation.
RSN 34 I The negative input of the remote sense amplifier. For a stand-alone device or the loop master device in a 2-phase configuration, connect the RSN pin to the ground at the load. For the loop slave device in a 2-phase configuration, the remote sense amplifier is not required for output-voltage sensing or regulation.
RT 1 I Frequency-setting resistor. Connect a resistor from this pin to AGND to program the switching frequency. Do not leave this pin floating.
SMB_ALRT 6 O SMBus™ alert pin. See the Supported PMBus Commands section.
SW 8 I/O Switched power output of the device. Connect the output averaging filter and bootstrap capacitor to this group of pins.
9
10
11
12
SYNC 39 I/O For frequency synchronization. For the stand-alone device or the loop master device in a 2-phase configuration, with external pullup to the BP6 pin, the SYNC pin will be configured as SYNC-IN pin, and will be synchronized to the rising edge of the external clock applied to this pin. Otherwise, the SYNC pin will be configured as SYNC-OUT pin. For the loop slave device in a 2-phase configuration, the SYNC pin will always be SYNC-IN, and will be synchronized to the falling edge of the incoming clock on SYNC pin. Only 50% duty cycle external clock can be applied to the 2-phase stack to realize the interleaving of 2 phases. Applying an external clock to both the loop master and the loop slave device to synchronize the stack is optional. Without the external clock, the loop master device will output a 50% duty-cycle clock to the loop slave device and the slave device will be synchronized to the falling edge of the clock. The SYNC pin can be left floating when not used.
VSHARE 32 I/O Voltage sharing signal for 2-phase operation. For stand-alone device, the VSHARE pin can be left floating.
Thermal pad — Package thermal pad, internally connected to PGND. The thermal pad must have adequate solder coverage for proper operation.
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