ZHCSMV4A December 2020 – December 2022 TPS548B28
PRODUCTION DATA
PARAMETER | TEST CONDITIONS | MIN | TYP | MAX | UNIT | |
---|---|---|---|---|---|---|
SUPPLY | ||||||
IQ(VIN) | VIN quiescent current | VIN = 12 V, VEN = 2 V, VFB = VINTREF + 50mV (non-switching), no external bias on VCC pin | 910 | 1007 | µA | |
ISD(VIN) | VIN shutdown supply current | VIN = 12 V, VEN = 0 V, no external bias on VCC pin | 9.5 | 20 | µA | |
IQ(VCC) | VCC quiescent current | TJ = 25°C, VIN = 12 V, VEN = 2 V, VFB = VINTREF + 50mV (non-switching), 3.3 V external bias on VCC pin | 680 | 820 | µA | |
ISD(VCC) | VCC shutdown current | VEN = 0 V, VIN = 0 V, 3.3 V external bias on VCC pin | 40 | 60 | µA | |
UVLO | ||||||
VINUVLO(rise) | VIN UVLO rising threshold | VIN rising, VCC = 3.3 V external bias | 2.1 | 2.4 | 2.7 | V |
VINUVLO(fall) | VIN UVLO falling threshold | VIN falling, VCC = 3.3 V external bias | 1.55 | 1.85 | 2.15 | V |
ENABLE | ||||||
VEN(rise) | EN voltage rising threshold | EN rising, enable switching | 1.17 | 1.22 | 1.27 | V |
VEN(fall) | EN voltage falling threshold | EN falling, disable switching | 0.97 | 1.02 | 1.07 | V |
VEN(hyst) | EN voltage hysteresis | 0.2 | V | |||
VEN(LKG) | Input leakage current into EN pin | VEN = 3.3 V | 0.5 | 5 | µA | |
EN internal pull-down resistance | EN pin to AGND. EN floating disables the converter. | 6500 | kΩ | |||
INTERNAL LDO (VCC PIN) | ||||||
Internal LDO output voltage | VIN = 12 V, IVCC(Load) = 2 mA | 2.90 | 3.02 | 3.12 | V | |
VCCUVLO(rise) | VCC UVLO rising threshold | VCC rising | 2.80 | 2.87 | 2.94 | V |
VCCUVLO(fall) | VCC UVLO falling threshold | VCC falling | 2.62 | 2.70 | 2.77 | |
VCCUVLO(hys) | VCC UVLO hysteresis | 0.17 | V | |||
VCC LDO dropout voltage, 20mA load | TJ = 25°C, VIN = 4.0 V, IVCC(Load) = 20 mA, non-switching | 1.037 | V | |||
VCC LDO short-circuit current limit | VIN = 12 V, all temperature | 52 | 105 | 158 | mA | |
FB Threshold to turn off VCC LDO | VCC LDO turn-off is controlled by FB voltage during EN shutdown event | 90 | 146 | mV | ||
REFERENCE VOLTAGE | ||||||
VINTREF | Internal voltage reference | TJ = 25°C | 600 | mV | ||
Internal voltage reference range | TJ = 0°C to 85°C | 597 | 603 | mV | ||
Internal voltage reference range | TJ = –40°C to 125°C | 594 | 606 | mV | ||
IFB(LKG) | Input leakage current into FB pin | VFB = VINTREF | 1 | 40 | nA | |
SS/REFIN-to-FB Accuracy | TJ = -40°C to 125°C, VSS/REFIN = 0.6 V, VSNS- = AGND, refer to VINTREF | –0.6% | 0.6% | |||
PSEUDO REMOTE SENSE | ||||||
SS/REFIN-to-FB Accuracy | TJ = -40°C to 125°C, VSS/REFIN = 0.6 V, VSNS- = AGND, refer to VINTREF | –3.6 | 3.6 | mV | ||
SWITCHING FREQUENCY | ||||||
fSW | SW switching frequency, FCCM operation | TJ = 25°C, VIN = 12 V, VOUT=1.25V, RMODE = 0 Ω to AGND | 0.5 | 0.6 | 0.7 | MHz |
TJ = 25°C, VIN = 12 V, VOUT=1.25V, RMODE = 30.1 kΩ to AGND | 0.6 | 0.7 | 0.8 | |||
TJ = 25°C, VIN = 12 V, VOUT=1.25V, RMODE = 60.4 kΩ to AGND | 0.70 | 0.85(3) | 1.0 | |||
STARTUP | ||||||
EN to first switching delay, internal LDO | The delay from EN goes high to the first SW rising edge with internal LDO configuration. CVCC = 2.2 µF. CSS/REFIN = 220 nF. | 0.93 | 2 | ms | ||
EN to first switching delay, external VCC bias | The delay from EN goes high to the first SW rising edge with external VCC bias configuration. VCC bias should reach regulation before EN ramp up. CSS/REFIN = 220 nF. | 0.55 | 0.9 | ms | ||
tSS | Internal fixed Soft-start time | VO rising from 0 V to 95% of final setpoint, CSS/REFIN = 1nF | 1 | 1.5 | ms | |
SS/REFIN sourcing current | VSS/REFIN = 0 V | 36 | µA | |||
SS/REFIN sinking current | VSS/REFIN = 1 V | 12 | µA | |||
POWER STAGE | ||||||
RDSON(HS) | High-side MOSFET on-resistance | TJ = 25°C, BOOT–SW = 3 V | 7.7 | mΩ | ||
RDSON(LS) | Low-side MOSFET on-resistance | TJ = 25°C, VCC = 3 V | 2.4 | mΩ | ||
tON(min) | Minimum on-time | TJ = 25°C, VCC = Internal LDO | 70 | 85 | ns | |
tOFF(min) | Minimum off-time | TJ = 25°C, VCC = Internal LDO, HS FET Gate falling to rising | 220 | ns | ||
BOOT CIRCUIT | ||||||
IBOOT(LKG) | BOOT leakage current | TJ = 25°C, VBOOT-SW = 3.3 V | 35 | 50 | µA | |
VBOOT-SW(UV_F) | BOOT-SW UVLO falling threshold | TJ = 25°C, VIN = 12 V, VBOOT-SW falling | 2.0 | V | ||
OVERCURRENT PROTECTION | ||||||
RTRIP | TRIP pin resistance range | 0 | 20 | kΩ | ||
Current limit clamp | Valley current on LS FET, 0-Ω ≤ RTRIP ≤ 5.24-kΩ | 19.2 | 22.9 | 25 | A | |
KOCL | Constant for RTRIP equation | 120000 | A×Ω | |||
IOCL (valley) | Current limit threshold | Valley current on LS FET, RTRIP = AGND | 19.2 | 22.9 | 25 | A |
IOCL (valley) | Current limit threshold | Valley current on LS FET, RTRIP = 5.23 kΩ | 22.9 | A | ||
IOCL (valley) | Current limit threshold | Valley current on LS FET, RTRIP = 6.04 kΩ | 19.9 | A | ||
IOCL (valley) | Current limit threshold | Valley current on LS FET, RTRIP = 7.5 kΩ | 16 | A | ||
IOCL (valley) | Current limit threshold | Valley current on LS FET, RTRIP = 10 kΩ | 12 | A | ||
IOCL (valley) | Current limit threshold | Valley current on LS FET, RTRIP = 14.7 kΩ | 8.2 | A | ||
IOCL (valley) | Current limit threshold | Valley current on LS FET, RTRIP = 20 kΩ | 6 | A | ||
KOCL | Constant KOCL tolerance | RTRIP = 5.23 kΩ | -16.4% | 9% | ||
KOCL | Constant KOCL tolerance | 6.04 kΩ ≤ RTRIP ≤ 10 kΩ | -12% | 12% | ||
KOCL | Constant KOCL tolerance | RTRIP = 14.7 kΩ | -18% | 18% | ||
KOCL | Constant KOCL tolerance | RTRIP = 20 kΩ | -21% | 21% | ||
INOCL | Negative current limit threshold | All VINs | –12 | –10 | –8 | A |
IZC | Zero-cross detection current threshold, open loop | VIN = 12 V, VCC = Internal LDO | 400 | mA | ||
OUTPUT OVP AND UVP | ||||||
VOVP | Output Overvoltage-protection (OVP) threshold voltage | 113% | 116% | 119% | ||
tOVP(delay) | Output OVP response delay | With 100-mV overdrive | 400 | ns | ||
VUVP | Output Undervoltage-protection (UVP) threshold voltage | 77% | 80% | 83% | ||
tUVP(delay) | Output UVP filter delay | 68 | µs | |||
POWER GOOD | ||||||
VPGTH | PGOOD threshold | PGOOD high, FB rising | 89% | 92.5% | 95% | |
PGOOD low, FB rising | 113% | 116% | 119% | |||
PGOOD low, FB falling | 77% | 80% | 83% | |||
OOB (Out-Of-Bounds) threshold | PGOOD high, FB rising | 103% | 105.5% | 108% | ||
IPG | PGOOD sink current | VPGOOD = 0.4 V, VIN = 12 V, VCC = Internal LDO | 17 | mA | ||
VPG(low) | PGOOD low-level output voltage | IPGOOD = 5.5 mA, VIN = 12 V, VCC = Internal LDO | 400 | mV | ||
tPGDLY(rise) | Delay for PGOOD from low to high | 1.06 | 1.33 | ms | ||
tPGDLY(fall) | Delay for PGOOD from high to low | 0.5 | 5 | µs | ||
IPG(LKG) | PGOOD leakage current when pulled high | TJ = 25°C, VPGOOD = 3.3 V, VFB = VINTREF | 5 | µA | ||
PGOOD clamp low-level output voltage | VIN = 0 V, VCC = 0 V, VEN = 0 V, PGOOD pulled up to 3.3 V through a 100-kΩ resistor | 710 | 850 | mV | ||
VIN = 0 V, VCC = 0 V, VEN = 0 V, PGOOD pulled up to 3.3 V through a 10-kΩ resistor | 850 | 1000 | mV | |||
Min VCC for valid PGOOD output | VPGOOD ≤ 0.4 V | 1.5 | V | |||
OUTPUT DISCHARGE | ||||||
RDischg | Output discharge resistance | VIN = 12 V, VCC = Internal LDO, VSW = 0.5 V, power conversion disabled | 70 | Ω | ||
THERMAL SHUTDOWN | ||||||
TSDN | Thermal shutdown threshold(1) | Temperature rising | 150 | 165 | °C | |
THYST | Thermal shutdown hysteresis(1) | 30 | °C |