10.3 Thermal Considerations

The maximum IC junction temperature should be restricted to 150°C under normal operating conditions. This restriction limits the power dissipation of the TPS55330. The TPS55330 features a thermally enhanced QFN package. This package includes a PowerPAD that improves the thermal capabilities of the package. The thermal resistance of the QFN package in any application greatly depends on the PCB layout and the PowerPAD connection. The PowerPAD must be soldered to the analog ground on the PCB. Use thermal vias underneath the PowerPAD to achieve good thermal performance.