ZHCSCL9A July   2014  – September 2021 TPS55340-EP

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 说明（续）
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 Handling Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Switching Frequency
      2. 8.3.2  Voltage Reference and Setting Output Voltage
      3. 8.3.3  Soft Start
      4. 8.3.4  Slope Compensation
      5. 8.3.5  Overcurrent Protection and Frequency Foldback
      6. 8.3.6  Enable and Thermal Shutdown
      7. 8.3.7  Undervoltage Lockout (UVLO)
      8. 8.3.8  Minimum On-Time and Pulse Skipping
      9. 8.3.9  Layout Considerations
      10. 8.3.10 Thermal Considerations
    4. 8.4 Device Functional Modes
      1. 8.4.1 Operation With VIN < 2.9 V (Minimum VIN)
      2. 8.4.2 Synchronization
      3. 8.4.3 Oscillator
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 Boost Converter Application
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
          1. 9.2.1.2.1  Selecting the Switching Frequency (R4)
          2. 9.2.1.2.2  Determining the Duty Cycle
          3. 9.2.1.2.3  Selecting the Inductor (L1)
          4. 9.2.1.2.4  Computing the Maximum Output Current
          5. 9.2.1.2.5  Selecting the Output Capacitor (C8 to C10)
          6. 9.2.1.2.6  Selecting the Input Capacitors (C2, C7)
          7. 9.2.1.2.7  Setting Output Voltage (R1, R2)
          8. 9.2.1.2.8  Setting the Soft-Start Time (C7)
          9. 9.2.1.2.9  Selecting the Schottky Diode (D1)
          10. 9.2.1.2.10 Compensating the Control Loop (R3, C4, C5)
        3. 9.2.1.3 Application Curves
      2. 9.2.2 SEPIC Converter Application
        1. 9.2.2.1 Design Requirements
        2. 9.2.2.2 Detailed Design Procedure
          1. 9.2.2.2.1  Selecting the Switching Frequency (R4)
          2. 9.2.2.2.2  Duty Cycle
          3. 9.2.2.2.3  Selecting the Inductor (L1)
          4. 9.2.2.2.4  Calculating the Maximum Output Current
          5. 9.2.2.2.5  Selecting the Output Capacitor (C8 to C10)
          6. 9.2.2.2.6  Selecting the Series Capacitor (C6)
          7. 9.2.2.2.7  Selecting the Input Capacitor (C2, C7)
          8. 9.2.2.2.8  Selecting the Schottky Diode (D1)
          9. 9.2.2.2.9  Setting the Output Voltage (R1, R2)
          10. 9.2.2.2.10 Setting the Soft-Start Time (C3)
          11. 9.2.2.2.11 MOSFET Rating Considerations
          12. 9.2.2.2.12 Compensating the Control Loop (R3, C4)
        3. 9.2.2.3 SEPIC Converter Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Examples
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 第三方米6体育平台手机版_好二三四免责声明
    2. 12.2 接收文档更新通知
    3. 12.3 支持资源
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 术语表
  13. 13Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

7.2 Handling Ratings

MINMAXUNIT
TstgStorage temperature range–65150°C
V(ESD)Electrostatic dischargeHuman body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1)–20002000V
Charged device model (CDM), per JEDEC specification JESD22-C101, all pins(2)–500500
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
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