ZHCSCK0C June 2014 – September 2021 TPS55340-Q1
PRODUCTION DATA
PIN | DESCRIPTION | |
---|---|---|
NAME | NO. | |
AGND | 6 | Signal ground of the IC |
COMP | 7 | Output of the transconductance error amplifier. An external RC network connected to this pin compensates the regulator feedback loop. |
EN | 3 | Enable pin. When the voltage of this pin falls below the enable threshold for more than 1 ms, the IC turns off. |
FB | 8 | Error amplifier input and feedback pin for positive voltage regulation. Connect the FB pin to the center tap of a resistor divider to program the output voltage. |
FREQ | 9 | Switching frequency program pin. An external resistor connected between the FREQ pin and the AGND pin sets the switching frequency. |
NC | 10 | This pin is reserved and must be connected to ground. |
14 | ||
PGND | 11 | Power ground of the IC. The PGND pin is connected to the source of the internal power MOSFET switch. |
12 | ||
13 | ||
SS | 4 | Soft-start programming pin. A capacitor between the SS pin and AGND pin programs soft-start timing. |
SW | 1 | SW is the drain of the internal power MOSFET. Connect the SW pin to the switched side of the boost or SEPIC inductor or the flyback transformer. |
15 | ||
16 | ||
SYNC | 5 | Switching frequency synchronization pin. An external clock signal can set the switching frequency between 200 kHz and 1 MHz. If this pin is not used, it must be tied to AGND. |
VIN | 2 | The input supply pin to the IC. Connect the VIN pin to a supply voltage between 2.9 V and 32 V. The voltage on the VIN pin can be different from the boost power stage input. |
PowerPAD | The PowerPAD must be soldered to AGND. If possible, use thermal vias to connect the PowerPAD to PCB ground plane layers for improved power dissipation. |