ZHCSBL8C September   2013  – February 2016 TPS560200

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 PWM Operation
      2. 7.3.2 PWM Frequency and Adaptive On-Time Control
      3. 7.3.3 Advanced Auto-Skip Eco-Mode Control
      4. 7.3.4 Soft-Start and Prebiased Soft-Start
      5. 7.3.5 Current Protection
      6. 7.3.6 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Normal Operation
      2. 7.4.2 Eco-Mode Operation
      3. 7.4.3 Standby Operation
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Output Voltage Resistors Selection
        2. 8.2.2.2 Output Filter Selection
        3. 8.2.2.3 Input Capacitor Selection
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11器件和文档支持
    1. 11.1 商标
    2. 11.2 静电放电警告
    3. 11.3 Glossary
  12. 12机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

6 Specifications

6.1 Absolute Maximum Ratings(1)

MIN MAX UNIT
Input voltage VIN –0.3 20 V
EN –0.3 7
VSENSE –0.3 3
Output voltage PH –0.6 20
PH 10-ns transient –2 20
Source current EN ±100 µA
PH Current limit A
Sink current PH Current limit A
Operating junction temperature –40 125 °C
Storage temperature, Tstg –65 150
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

6.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V
Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±500
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
VI Input voltage range 4.5 17 V
TJ Operating junction temperature –40 125 °C

6.4 Thermal Information

THERMAL METRIC(1) TPS560200 UNIT
DBV
5 Pins
RθJA Junction-to-ambient thermal resistance 166.8 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 100
RθJB Junction-to-board thermal resistance 75.5
ψJT Junction-to-top characterization parameter 29.2
ψJB Junction-to-board characterization parameter 3.7
RθJC(bot) Junction-to-case (bottom) thermal resistance 28.7
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.

6.5 Electrical Characteristics

TJ = –40°C to 125°C, VIN = 4.5 V to 17 V (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
SUPPLY VOLTAGE (VIN PIN)
VIN Operating input voltage 4.5 17 V
VIN Internal UVLO threshold VIN Rising 3.9 4.35 4.5 V
VIN Internal UVLO hysteresis 200 mV
VIN Shutdown supply current EN = 0 V, VIN = 12 V 2.0 3.7 9 µA
VIN Operating– non switching supply current VSENSE = 850 mV, VIN = 12 V 35 60 95 µA
ENABLE (EN PIN)
Enable threshold Rising 1.16 1.29 V
Falling 1.05 1.13 V
Internal Soft-Start VSENSE ramps from 0 V to 0.8 V 2 ms
OUTPUT VOLTAGE
Voltage reference 25°C, VIN = 12 V, VOUT = 1.05 V, IOUT = 5 mA, Pulse-Skipping 0.796 0.804 0.812 V
25°C, VIN = 12 V, VOUT = 1.05 V, IOUT = 100 mA, Continuous current mode 0.792 0.800 0.808 V
VIN = 12 V, VOUT = 1.05 V, IOUT = 100 mA, Continuous current mode 0.789 0.800 0.811 V
MOSFET
High-side switch resistance(2)(1) VIN = 12 V 0.50 0.95 1.50 Ω
Low-side switch resistance(2) VIN = 12 V 0.20 0.33 0.55 Ω
CURRENT LIMIT
Low-side switch sourcing current limit LOUT = 10 µH, Valley current, VOUT = 1.05 V 550 650 775 mA
THERMAL SHUTDOWN
Thermal shutdown 170 °C
Thermal shutdown hysteresis 10 °C
ON-TIME TIMER CONTROL
On time VIN = 12 V 130 165 200 ns
Minimum off time 25°C, VSENSE = 0.5 V 250 400 ns
OUTPUT UNDERVOLTAGE PROTECTION
Output UVP threshold Falling 56 63 69 %VREF
Hiccup time 15 ms
(1) Measured at pins
(2) Not production tested

6.6 Typical Characteristics

VIN = 12 V, TA = 25°C (unless otherwise noted).
TPS560200 C001_SLVSC81.png
Figure 1. Supply Current vs Junction Temperature
TPS560200 C003_SLVSC81.png
Figure 3. EN Input Current vs EN Input Voltage
TPS560200 C005_SLVSC81.png
Figure 5. Switching Frequency vs Output Current
TPS560200 C002_SLVSC81.png
Figure 2. Shutdown Current vs Junction Temperature
TPS560200 C004_SLVSC81.png
Figure 4. Switching Frequency vs Input Voltage
TPS560200 C006_SLVSC81.png
Figure 6. VSENSE Voltage vs Junction Temperature
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