SLUSAH4D MARCH   2011  – February 2016 TPS56121

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Voltage Reference
      2. 7.3.2  Enable Functionality, Startup Sequence and Timing
        1. 7.3.2.1 COMP Pin Impedance Sensing
        2. 7.3.2.2 Overcurrent Protection (OCP) Setting
      3. 7.3.3  Soft-Start Time
      4. 7.3.4  Oscillator
      5. 7.3.5  Overcurrent Protection (OCP)
      6. 7.3.6  Switching Node (SW)
      7. 7.3.7  Input Undervoltage Lockout (UVLO)
      8. 7.3.8  Pre-Bias Startup
      9. 7.3.9  Power Good
      10. 7.3.10 Thermal Shutdown
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1  Switching Frequency Selection
        2. 8.2.2.2  Inductor Selection (L1)
        3. 8.2.2.3  Output Capacitor Selection
        4. 8.2.2.4  Inductor Peak Current Rating
        5. 8.2.2.5  Input Capacitor Selection
        6. 8.2.2.6  Bootstrap Capacitor (C14)
        7. 8.2.2.7  Bootstrap Resistor (R2)
        8. 8.2.2.8  RC Snubber (R9 and C18)
        9. 8.2.2.9  VDD Bypass Capacitor (C11)
        10. 8.2.2.10 BP5 Bypass Capacitor (C12)
        11. 8.2.2.11 Soft-Start Capacitor (C13)
        12. 8.2.2.12 Current Limit (R1)
        13. 8.2.2.13 Feedback Divider (R4, R7)
        14. 8.2.2.14 Compensation (C15, C16, C17, R3, R6)
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
    2. 11.2 Trademarks
    3. 11.3 Electrostatic Discharge Caution
    4. 11.4 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

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机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

11 Device and Documentation Support

11.1 Device Support

11.1.1 Third-Party Products Disclaimer

TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE.

11.2 Trademarks

PowerPAD, SWIFT, NexFET are trademarks of Texas Instruments.

All other trademarks are the property of their respective owners.

11.3 Electrostatic Discharge Caution

esds-image

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

11.4 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.
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