ZHCSCT6A September   2014  – November 2016 TPS562209 , TPS563209

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics TPS562209
    7. 6.7 Typical Characteristics TPS563209
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 The Adaptive On-Time Control and PWM Operation
      2. 7.3.2 Soft Start and Pre-Biased Soft Start
      3. 7.3.3 Current Protection
      4. 7.3.4 Over Voltage Protection
      5. 7.3.5 UVLO Protection
      6. 7.3.6 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Normal Operation
      2. 7.4.2 Forced CCM Operation
      3. 7.4.3 Standby Operation
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 TPS562209 4.5-V to 17-V Input, 1.05-V Output Converter
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Output Voltage Resistors Selection
          2. 8.2.1.2.2 Output Filter Selection
          3. 8.2.1.2.3 Input Capacitor Selection
          4. 8.2.1.2.4 Bootstrap Capacitor Selection
        3. 8.2.1.3 Application Curves
      2. 8.2.2 TPS563209 4.5-V to 17-V Input, 1.05-V Output Converter
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedures
          1. 8.2.2.2.1 Output Filter Selection
        3. 8.2.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11器件和文档支持
    1. 11.1 相关链接
    2. 11.2 接收文档更新通知
    3. 11.3 社区资源
    4. 11.4 商标
    5. 11.5 静电放电警告
    6. 11.6 Glossary
  12. 12机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

6 Specifications

6.1 Absolute Maximum Ratings

TJ = –40°C to 150°C (unless otherwise noted) (1)
MIN MAX UNIT
Input voltage range VIN, EN –0.3 19 V
VBST –0.3 25 V
VBST (10 ns transient) –0.3 27.5 V
VBST (vs SW) –0.3 6.5 V
VFB, –0.3 6.5 V
SW –2 19 V
SW (10 ns transient) –3.5 21 V
Operating junction temperature, TJ –40 150 °C
Storage temperature, Tstg –55 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

6.2 ESD Ratings

MIN MAX UNIT
V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1) 2 kV
Charged device model (CDM), per JEDEC specification JESD22-C101, all pins(2) 500 V
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

TJ = -40°C to 150°C (unless otherwise noted)
MIN MAX UNIT
VIN Supply input voltage range 4.5 17 V
VI Input voltage range VBST –0.1 23 V
VBST (10 ns transient) –0.1 26
VBST(vs SW) –0.1 6.0
EN –0.1 17
VFB –0.1 5.5
SW –1.8 17
SW (10 ns transient) –3.5 20
TA Operating free-air temperature –40 85 °C

6.4 Thermal Information

THERMAL METRIC(1) TPS562209 TPS563209 UNIT
DDC (6 PINS)
RθJA Junction-to-ambient thermal resistance 109.2 87.9 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 44.5 42.2
RθJB Junction-to-board thermal resistance 13.4 13.6
ψJT Junction-to-top characterization parameter 2.3 1.9
ψJB Junction-to-board characterization parameter 60.4 13.3
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

6.5 Electrical Characteristics

TJ = -40°C to 150°C, VIN = 12V (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
SUPPLY CURRENT
IVIN Operating – non-switching supply current VIN current, TA = 25°C, EN = 5V, VFB = 0.8 V 650 900 µA
µA
IVINSDN Shutdown supply current VIN current, TA = 25°C, EN = 0 V 3.0 10 µA
LOGIC THRESHOLD
VENH EN high-level input voltage EN 1.6 V
VENL EN low-level input voltage EN 0.6 V
REN EN pin resistance to GND VEN = 12 V 225 450 900 kΩ
VFB VOLTAGE AND DISCHARGE RESISTANCE
VFBTH VFB threshold voltage TA = 25°C, VO = 1.05 V, continuous mode operation 758 765 772 mV
IVFB VFB input current VFB = 0.8V, TA = 25°C 0 ±0.1 mA
MOSFET
RDS(on)h High side switch resistance TA = 25°C, VBST – SW = 5.5 V (TPS562209) 122 mΩ
TA = 25°C, VBST – SW = 5.5 V (TPS563209) 68
RDS(on)l Low side switch resistance TA = 25°C (TPS562209) 72 mΩ
TA = 25°C (TPS563209) 39
CURRENT LIMIT
Iocl Current limit(1) DC current, VOUT = 1.05V , L1 = 2.2 µH 2.5 3.2 4.3 A
DC current, VOUT = 1.05V , L1 = 1.5 µH 3.5 4.2 5.3
THERMAL SHUTDOWN
TSDN Thermal shutdown threshold(1) Shutdown temperature 155 °C
Hysteresis 35
ON-TIME TIMER CONTROL
tON On time VIN = 12 V, VO = 1.05 V 150 ns
tOFF(MIN) Minimum off time TA = 25°C, VFB = 0.5 V 260 310 ns
SOFT START
Tss Soft –start time Internal soft-start time, TA = 25°C 0.7 1.0 1.3 ms
OUTPUT UNDERVOLTAGE AND OVERVOLTAGE PROTECTION
VOVP Output OVP threshold OVP Detect 125%xVfbth
VUVP Output UVP threshold Hiccup detect 65%xVfbth
THiccupOn Hiccup Power On Time Relative to soft start time 1 ms
THiccupOff Hiccup Power Off Time Relative to soft start time 7 ms
UVLO
UVLO UVLO threshold Wake up VIN voltage 3.45 3.75 4.05 V
Hysteresis VIN voltage 0.13 0.32 0.55
(1) Not production tested.

6.6 Typical Characteristics TPS562209

VIN = 12V (unless otherwise noted)
TPS562209 TPS563209 D001_SLVSCM5.gif
Figure 1. Supply Current vs Junction Temperature
TPS562209 TPS563209 D003_SLVSCM5.gif
Figure 3. VFB Voltage vs Junction Temperature
TPS562209 TPS563209 D005_SLVSCM5.gif
Figure 5. Efficiency vs Output Current
TPS562209 TPS563209 D007_SLVSCM5.gif
Figure 7. Output Current vs Ambient Temperature
TPS562209 TPS563209 D009_SLVSCM5.gif
Figure 9. Switching Frequency vs Output Current
TPS562209 TPS563209 D002_SLVSCM5.gif
Figure 2. VIN Shutdown Current vs Junction Temperature
TPS562209 TPS563209 D004_SLVSCM5.gif
Figure 4. EN Current vs EN Voltage
TPS562209 TPS563209 D006_SLVSCM5.gif
Figure 6. Efficiency vs Output current (VI = 5 V)
TPS562209 TPS563209 D008_SLVSCM5.gif
Figure 8. Switching Frequency vs Input Voltage

6.7 Typical Characteristics TPS563209

VIN = 12V (unless otherwise noted)
TPS562209 TPS563209 D010_SLVSCM5.gif
Figure 10. Supply Current vs Junction Temperature
TPS562209 TPS563209 D012_SLVSCM5.gif
Figure 12. VFB Voltage vs Junction Temperature
TPS562209 TPS563209 D014_SLVSCM5.gif
Figure 14. Efficiency vs Output Current
TPS562209 TPS563209 D016_SLVSCM5.gif
Figure 16. Output Current vs Ambient Temperature
TPS562209 TPS563209 D018_SLVSCM5.gif
Figure 18. Switching Frequency vs Output Current
TPS562209 TPS563209 D011_SLVSCM5.gif
Figure 11. VIN Shutdown Current vs Junction Temperature
TPS562209 TPS563209 D013_SLVSCM5.gif
Figure 13. EN Current vs EN Voltage
TPS562209 TPS563209 D015_SLVSCM5.gif
Figure 15. Efficiency vs Output current (VI = 5 V)
TPS562209 TPS563209 D017_SLVSCM5.gif
Figure 17. Switching Frequency vs Input Voltage
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