ZHCS124C MARCH 2011 – January 2015 TPS56221
PRODUCTION DATA.
- 1 特性
- 2 应用范围
- 3 说明
- 4 修订历史记录
- 5 Pin Configuration and Functions
- 6 Specifications
-
7 Detailed Description
- 7.1 Overview
- 7.2 Functional Block Diagram
- 7.3 Feature Description
- 7.4 Device Functional Modes
-
8 Application and Implementation
- 8.1 Application Information
- 8.2
Typical Application
- 8.2.1 Design Requirements
- 8.2.2
Detailed Design Procedure
- 8.2.2.1 Switching Frequency Selection
- 8.2.2.2 Inductor Selection
- 8.2.2.3 Output Capacitor Selection
- 8.2.2.4 Inductor Peak Current Rating
- 8.2.2.5 Input Capacitor Selection
- 8.2.2.6 Boot-Strap Capacitor (C14)
- 8.2.2.7 Boot-Strap Resistor (R2)
- 8.2.2.8 VDD Bypass Capacitor (C11)
- 8.2.2.9 BP5 Bypass Capacitor (C12)
- 8.2.2.10 Soft-Start Capacitor (C13)
- 8.2.2.11 Current Limit (R1)
- 8.2.2.12 Feedback Divider (R4, R7)
- 8.2.2.13 Compensation (C15, C16, C17, R3, R6)
- 8.2.3 Application Curves
- 9 Power Supply Recommendations
- 10Layout
- 11器件和文档支持
- 12机械、封装和可订购信息
封装选项
请参考 PDF 数据表获取器件具体的封装图。
机械数据 (封装 | 引脚)
- DQP|22
散热焊盘机械数据 (封装 | 引脚)
- DQP|22
订购信息
11 器件和文档支持
11.1 器件支持
11.1.1 第三方米6体育平台手机版_好二三四免责声明
TI 发布的与第三方米6体育平台手机版_好二三四或服务有关的信息，不能构成与此类米6体育平台手机版_好二三四或服务或保修的适用性有关的认可，不能构成此类米6体育平台手机版_好二三四或服务单独或与任何 TI 米6体育平台手机版_好二三四或服务一起的表示或认可。
11.2 商标
PowerPAD, NexFET are trademarks of Texas Instruments.
All other trademarks are the property of their respective owners.
11.3 静电放电警告
这些装置包含有限的内置 ESD 保护。 存储或装卸时，应将导线一起截短或将装置放置于导电泡棉中，以防止 MOS 门极遭受静电损伤。