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ZHCSFM7C October 2016 – August 2023 TPS568215

PRODUCTION DATA

6.4 Thermal Information

THERMAL METRIC⁽¹⁾		RNN PACKAGE	UNIT
THERMAL METRIC⁽¹⁾		18 PINS	UNIT
R_θJA	Junction-to-ambient thermal resistance	42.3	°C/W
R_θJC(top)	Junction-to-case (top) thermal resistance	23.9	°C/W
R_θJB	Junction-to-board thermal resistance	10.0	°C/W
ψ_JT	Junction-to-top characterization parameter	0.5	°C/W
ψ_JB	Junction-to-board characterization parameter	10.0	°C/W
R_θJC(bot)	Junction-to-case (bottom) thermal resistance	0.5	°C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.