ZHCSEU8G March   2016  – August 2024 TPS56C215

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Timing Requirements
    7. 5.7 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1  PWM Operation and D-CAP3™ Control Mode
      2. 6.3.2  Eco-mode Control
      3. 6.3.3  4.7-V LDO
      4. 6.3.4  MODE Selection
      5. 6.3.5  Soft Start and Prebiased Soft Start
      6. 6.3.6  Enable and Adjustable UVLO
      7. 6.3.7  Power Good
      8. 6.3.8  Overcurrent Protection and Undervoltage Protection
      9. 6.3.9  UVLO Protection
      10. 6.3.10 Thermal Shutdown
      11. 6.3.11 Output Voltage Discharge
    4. 6.4 Device Functional Modes
      1. 6.4.1 Light Load Operation
      2. 6.4.2 Standby Operation
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1 External Component Selection
          1. 7.2.2.1.1 Output Voltage Set Point
          2. 7.2.2.1.2 Switching Frequency and MODE Selection
          3. 7.2.2.1.3 Inductor Selection
          4. 7.2.2.1.4 Output Capacitor Selection
          5. 7.2.2.1.5 Input Capacitor Selection
      3. 7.2.3 Application Curves
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 第三方米6体育平台手机版_好二三四免责声明
      2. 8.1.2 Development Support
    2. 8.2 接收文档更新通知
    3. 8.3 支持资源
    4. 8.4 Trademarks
    5. 8.5 静电放电警告
    6. 8.6 术语表
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information
    1. 10.1 Package Marking

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

5.4 Thermal Information

THERMAL METRIC(1)RNN (VQFN-HR)UNIT
18 PINS
RθJAJunction-to-ambient thermal resistance29.5°C/W
RθJC(top)Junction-to-case (top) thermal resistance17.0°C/W
RθJBJunction-to-board thermal resistance8.6°C/W
ψJTJunction-to-top characterization parameter0.4°C/W
ψJBJunction-to-board characterization parameter8.6°C/W
RθJC(bot)Junction-to-case (bottom) thermal resistance0.5°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application note.
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