over operating free-air temperature range (unless otherwise noted) (1) | MIN | MAX | UNIT |
|---|
| Input Voltage | VIN | –0.3 | 20 | V |
| SW | –2 | 19 |
| SW (10-ns
transient) | –5 | 25 |
| VIN-SW | |
22
|
| VIN-SW
(10-ns transient) | |
25
|
| EN | –0.3 | 6.5 |
| BOOT –SW | –0.3 | 6.5 |
| BOOT –SW (10 ns transient) | –0.3 |
7.5
|
| BOOT | –0.3 | 25.5 |
| SS, MODE, FB | –0.3 | 6.5 |
| VREG5 | –0.3 | 6 |
| Output Voltage | PGOOD | –0.3 | 6.5 | V |
| Output Current(2) | IOUT | | 14 | A |
| TJ | Operating junction temperature | –40 | 150 | °C |
| Tstg | Storage temperature | –55 | 150 | °C |
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) to be consistent with the TI reliability requirement of 100k Power-On-Hours at 105°C junction temperature, the output current must not exceed 14A continuously under 100% duty operation as to prevent electromigration failure in the solder. Higher junction temperature or longer power-on hours are achievable at lower than 14A continuos output current.