ZHCSE52B September   2015  – May 2019 TPS57140-EP

PRODUCTION DATA.  

  1. 特性
  2. 应用范围
  3. 说明
    1.     Device Images
      1.      简化原理图
      2.      效率与负载电流间的关系
  4. 修订历史记录
  5. Pin Configuration and Functions
    1.     Pin Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Fixed Frequency PWM Control
      2. 7.3.2  Slope-Compensation Output Current
      3. 7.3.3  Bootstrap Voltage (Boot)
      4. 7.3.4  Low-Dropout Operation
      5. 7.3.5  Error Amplifier
      6. 7.3.6  Voltage Reference
      7. 7.3.7  Adjusting the Output Voltage
      8. 7.3.8  Enable and Adjusting UVLO
      9. 7.3.9  Slow-Start or Tracking Pin (SS/TR)
      10. 7.3.10 Overload Recovery Circuit
      11. 7.3.11 Constant Switching Frequency and Timing Resistor (RT/CLK Pin)
      12. 7.3.12 Overcurrent Protection and Frequency Shift
      13. 7.3.13 Selecting the Switching Frequency
      14. 7.3.14 How to Interface to RT/CLK Pin
      15. 7.3.15 Power Good (PWRGD Pin)
      16. 7.3.16 Overvoltage Transient Protection (OVTP)
      17. 7.3.17 Thermal Shutdown
      18. 7.3.18 Small-Signal Model for Loop Response
      19. 7.3.19 Simple Small-Signal Model for Peak-Current-Mode Control
      20. 7.3.20 Small-Signal Model for Frequency Compensation
    4. 7.4 Device Functional Modes
      1. 7.4.1 Sequencing
      2. 7.4.2 Pulse-Skip Eco-mode Control Scheme
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1  Selecting the Switching Frequency
        2. 8.2.2.2  Output Inductor Selection (LO)
        3. 8.2.2.3  Output Capacitor
        4. 8.2.2.4  Catch Diode
        5. 8.2.2.5  Input Capacitor
        6. 8.2.2.6  Slow-Start Capacitor
        7. 8.2.2.7  Bootstrap Capacitor Selection
        8. 8.2.2.8  UVLO Set Point
        9. 8.2.2.9  Output Voltage and Feedback Resistors Selection
        10. 8.2.2.10 Compensation
      3. 8.2.3 Application Curves
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 Power-Dissipation Estimate
  11. 11器件和文档支持
    1. 11.1 接收文档更新通知
    2. 11.2 社区资源
    3. 11.3 商标
    4. 11.4 静电放电警告
    5. 11.5 Glossary
  12. 12机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

Power-Dissipation Estimate

The following formulas show how to estimate the IC power dissipation under CCM operation. Do not use these equations used if the device is working in DCM.

The power dissipation of the IC includes conduction loss (Pcon), switching loss (Psw), gate-drive loss (Pgd), and supply current (Pq).

Equation 54. TPS57140-EP eq56_lvs795.gif
Equation 55. TPS57140-EP eq55_lvsa24.gif
Equation 56. TPS57140-EP eq56_lvsa24.gif
Equation 57. TPS57140-EP eq57_lvsa24.gif

where

  • IOUT is the output current (A).
  • Rdson is the on-resistance of the high-side MOSFET (Ω).
  • VOUT is the output voltage (V).
  • VIN is the input voltage (V).
  • ƒSW is the switching frequency (Hz).

So,

Equation 58. TPS57140-EP eq60_lvs795.gif

For a given TA,

Equation 59. TPS57140-EP eq61_lvs795.gif

For a given TJMAX = 150°C

Equation 60. TPS57140-EP eq62_lvs795.gif

where

  • PTOT is the total device power dissipation (W).
  • TA is the ambient temperature (°C).
  • TJ is the junction temperature (°C).
  • Rth is the thermal resistance of the package (°C/W).
  • TJ(max) is maximum junction temperature (°C).
  • TA(max) is maximum ambient temperature (°C).

There are additional power losses in the regulator circuit, due to the inductor ac and dc losses, the catch diode, and trace resistance, that impact the overall efficiency of the regulator.