ZHCSOQ1D october 2022 – september 2023 TPS61033 , TPS610333
PRODUCTION DATA
- 1
- 1 特性
- 2 应用
- 3 说明
- 4 Device Comparison Table
- 5 Revision History
- 6 Pin Configuration and Functions
- 7 Specifications
-
8 Detailed Description
- 8.1 Overview
- 8.2 Functional Block Diagram
- 8.3
Feature Description
- 8.3.1 Undervoltage Lockout
- 8.3.2 Enable and Soft Start
- 8.3.3 Setting the Output Voltage
- 8.3.4 Current Limit Operation
- 8.3.5 Pass-Through Operation
- 8.3.6 Power Good Indicator
- 8.3.7 Implement Output Discharge by PG function
- 8.3.8 Overvoltage Protection
- 8.3.9 Output Short-to-Ground Protection
- 8.3.10 Thermal Shutdown
- 8.4 Device Functional Modes
- 9 Application and Implementation
- 10Device and Documentation Support
- 11Mechanical, Packaging, and Orderable Information
9.4.3 Thermal Considerations
Restrict the maximum IC junction temperature to 125°C under normal operating conditions. Calculate the maximum allowable dissipation, PD(max), and keep the actual power dissipation less than or equal to PD(max). The maximum-power-dissipation limit is determined using Equation 11.
where
- TA is the maximum ambient temperature for the application
- RθJA is the junction-to-ambient thermal resistance given in Section 9.4.3
The TPS61033 comes in a SOT583 package. The real junction-to-ambient thermal resistance of the package greatly depends on the PCB type, layout. Using larger and thicker PCB copper for the power pads (GND, SW, and VOUT) to enhance the thermal performance. Using more vias connects the ground plate on the top layer and bottom layer around the IC without solder mask also improves the thermal capability.