ZHCSDL4 April 2015 TPS61046
PRODUCTION DATA.
MIN | MAX | UNIT | ||
---|---|---|---|---|
Voltage range at terminals (2) | VIN, EN, FB | – 0.3 | 6 | V |
SW, VOUT | –0.3 | 32 | V | |
Operating junction temperature range, TJ | –40 | 150 | °C | |
Storage temperature range, Tstg | –65 | 150 | °C |
VALUE | UNIT | |||
---|---|---|---|---|
V(ESD)(1) | Electrostatic discharge | Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(2) | ±2000 | V |
Charged device model (CDM), per JEDEC specification JESD22-C101, all pins(3) | ±500 | V |
MIN | TYP | MAX | UNIT | ||
---|---|---|---|---|---|
VIN | Input voltage range | 1.8 | 5.5 | V | |
VOUT | Output voltage range | 4.5 | 28 | V | |
L | Effective inductance range | 1.0×0.7 | 10 | 22×1.3 | µH |
CIN | Effective input capacitance range | 0.22 | 1.0 | µF | |
COUT | Effective output capacitance range | 0.22 | 1.0 | 10 | µF |
TJ | Operating junction temperature | –40 | 125 | °C |
THERMAL METRIC(1) | TPS61046 | UNIT | |
---|---|---|---|
YFF (WCSP) | |||
6 BALLS | |||
RθJA | Junction-to-ambient thermal resistance | 135.4 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 1.6 | |
RθJB | Junction-to-board thermal resistance | 22.3 | |
ψJT | Junction-to-top characterization parameter | 5.6 | |
ψJB | Junction-to-board characterization parameter | 22.3 | |
RθJC(bot) | Junction-to-case (bottom) thermal resistance | n/a |
PARAMETER | TEST CONDITIONS | MIN | TYP | MAX | UNIT | |
---|---|---|---|---|---|---|
POWER SUPPLY | ||||||
VIN | Input voltage range | 1.8 | 5.5 | V | ||
VIN_UVLO | Under voltage lockout threshold | VIN rising | 1.75 | 1.8 | V | |
VIN falling | 1.55 | 1.6 | ||||
VIN_HYS | VIN UVLO hysteresis | 200 | mV | |||
IQ_VIN | Quiescent current into VIN pin | IC enabled, no load, no switching, VIN = 1.8 V to 5.5 V, VOUT = 12 V | 110 | 200 | µA | |
ISD | Shutdown current into VIN pin | IC disabled, VIN = 1.8 V to 5.5 V, TJ up to 85°C | 0.1 | 0.8 | µA | |
IC disabled, VIN = 1.8 V to 5.5 V, TJ up to 60°C | 0.5 | µA | ||||
OUTPUT | ||||||
VOUT | Output voltage range | 4.5 | 28 | V | ||
VOUT_12V | 12-V output voltage accuracy | FB pin connected to VIN pin, TJ=0°C to 125°C | 11.7 | 12 | 12.3 | V |
VREF | Feedback voltage | PWM mode, TJ=0°C to 125°C | 0.779 | 0.795 | 0.811 | V |
PFM mode, TJ=0°C to 125°C | 0.803 | V | ||||
VOVP | Output overvoltage protection threshold | 28 | 29.2 | 30.4 | V | |
VOVP_HYS | Over voltage protection hysteresis | 0.8 | V | |||
IFB_LKG | Leakage current into FB pin | 200 | nA | |||
ISW_LKG | Leakage current into SW pin | IC disabled, TJ up to 85°C | 500 | nA | ||
POWER SWITCH | ||||||
RDS(on) | Isolation MOSFET on resistance | VOUT = 12 V | 850 | mΩ | ||
Low-side MOSFET on resistance | VOUT = 12 V | 450 | ||||
fSW | Switching frequency | VIN = 3.6 V, VOUT = 12 V, PWM mode | 850 | 1050 | 1250 | kHz |
tON_min | Minimal switch on time | 150 | 250 | ns | ||
ILIM_SW | Peak switch current limit | VIN = 3.6 V, VOUT = 12 V | 600 | 900 | 1200 | mA |
ILIM_CHG | Pre-charge current | VIN = 3.6 V, VOUT = 0 V | 30 | 50 | mA | |
tSTARTUP | Startup time | VOUT from VIN to 12 V, COUT_effective = 2.2 µF, IOUT = 0 A | 2 | 5 | ms | |
LOGIC INTERFACE | ||||||
VEN_H | EN Logic high threshold | 1 | V | |||
VEN_L | EN Logic Low threshold | 0.4 | V | |||
PROTECTION | ||||||
TSD | Thermal shutdown threshold | TJ rising | 150 | °C | ||
TSD_HYS | Thermal shutdown hysteresis | TJ falling below TSD | 20 | °C |
VIN = 1.8 V, 3.0 V, 3.6 V, 4.2 V, VOUT = 12 V | ||
VIN = 3.6 V, VOUT = 12 V, FB pin connected to VIN pin | ||
VIN = 3.6 V, VOUT = 12 V, No switching | ||
VIN = 3.6 V | ||
VIN = 1.8 V ~ 6 V, VOUT = 12 V | ||
VIN = 3.6 V, VOUT = 5 V, 12 V, 24 V | ||
VIN = 3.6 V, VOUT = 12 V | ||
VIN = 1.8 V ~ 6 V, VOUT = 12 V, No switching | ||
VIN = 3.6 V, VOUT = 12 V | ||