The allowable IC junction temperature must be considered under normal operating conditions. This restriction limits the power dissipation of the TPS61169. The allowable power dissipation for the device can be determined by Equation 7:

Equation 7.

where

• T_J is allowable junction temperature given in recommended operating conditions
• T_A is the ambient temperature for the application
• R_θJA is the thermal resistance junction-to-ambient given in Power Dissipation Table

The TPS61169 device also features a thermal foldback function to reduce the thermal stress automatically.