SLVS789D November   2007  – December 2014 TPS61170

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Typical Application Schematic
  5. 5 Revision History
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Soft Start-Up
      2. 8.3.2 Overcurrent Protection
      3. 8.3.3 Undervoltage Lockout (UVLO)
      4. 8.3.4 Thermal Shutdown
      5. 8.3.5 Enable and Shutdown
    4. 8.4 Device Functional Modes
      1. 8.4.1 Feedback Reference Program Mode Selection
      2. 8.4.2 PWM Program Mode
      3. 8.4.3 1-Wire Program Mode
    5. 8.5 Programming
      1. 8.5.1 EasyScale
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Program Output Voltage
        2. 9.2.2.2 Maximum Output Current
        3. 9.2.2.3 Switch Duty Cycle
        4. 9.2.2.4 Inductor Selection
        5. 9.2.2.5 Schottky Diode Selection
        6. 9.2.2.6 Compensation Capacitor Selection
        7. 9.2.2.7 Input and Output Capacitor Selection
      3. 9.2.3 Application Curves
    3. 9.3 System Examples
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
    3. 11.3 Thermal Considerations
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Third-Party Products Disclaimer
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

5 Revision History

Changes from C Revision (April 2011) to D Revision

  • Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information sectionGo

Changes from B Revision (November 2009) to C Revision

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