ZHCSD56 December 2014 TPS61175-Q1
PRODUCTION DATA.
PIN | I/O | DESCRIPTION | |
---|---|---|---|
NAME | NO. | ||
VIN | 3 | I | The input supply pin for the IC. Connect VIN to a supply voltage between 2.9 V and 18 V. It is acceptable for the voltage on the pin to be different from the boost power stage input for applications requiring voltage beyond VIN range. |
SW | 1,2 | I | This is the switching node of the IC. Connect SW to the switched side of the indu1ctor. |
FB | 9 | I | Feedback pin for positive voltage regulation. Connect to the center tap of a resistor divider to program the output voltage. |
EN | 4 | I | Enable pin. When the voltage of this pin falls below the enable threshold for more than 10 ms, the IC turns off. |
COMP | 8 | O | Output of the internal transconductance error amplifier. An external RC network is connected to this pin to compensate the regulator. |
SS | 5 | O | Soft start programming pin. A capacitor between the SS pin and GND pin programs soft start timing. See application section for information on how to size the SS capacitor. |
FREQ | 10 | O | Switch frequency program pin. An external resistor is connected to this pin to set switch frequency. See application section for information on how to size the FREQ resistor. |
AGND | 7 | I | Signal ground of the IC |
PGND | 12,13,14 | I | Power ground of the IC. It is connected to the source of the PWM switch. |
SYNC | 6 | I | Switch frequency synchronous pin. Customers can use an external signal to set the IC switch frequency between 200-kHz and 2.2-MHz. If not used, this pin should be tied to AGND as short as possbile to avoid noise coupling. |
NC | 11 | I | Reserved pin. Must connect this pin to ground. |
Thermal Pad | The thermal pad should be soldered to the analog ground. If possible, use thermal via to connect to top and internal ground plane layers for ideal power dissipation. |