ZHCS002E March   2007  – December 2014 TPS61200 , TPS61201 , TPS61202

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用范围
  3. 3 说明
  4. 4 典型应用
  5. 5 修订历史记录
  6. 6 Device Options
  7. 7 Pin Configuration and Functions
  8. 8 Specifications
    1. 8.1 Absolute Maximum Ratings
    2. 8.2 ESD Ratings
    3. 8.3 Recommended Operating Conditions
    4. 8.4 Thermal Information
    5. 8.5 Electrical Characteristics
    6. 8.6 Typical Characteristics
  9. 9 Parameter Measurement Information
  10. 10Detailed Description
    1. 10.1 Overview
    2. 10.2 Functional Block Diagram
    3. 10.3 Feature Description
      1. 10.3.1 Controller Circuit
        1. 10.3.1.1 Synchronous Operation
        2. 10.3.1.2 Down Regulation
        3. 10.3.1.3 Device Enable
        4. 10.3.1.4 Softstart and Short-Circuit Protection
        5. 10.3.1.5 Current Limit
        6. 10.3.1.6 Undervoltage Lockout
        7. 10.3.1.7 Thermal Shutdown
    4. 10.4 Device Functional Modes
      1. 10.4.1 Power Save Mode
      2. 10.4.2 Down Conversion Mode
  11. 11Application and Implementation
    1. 11.1 Application Information
    2. 11.2 Typical Application
      1. 11.2.1 Design Requirements
      2. 11.2.2 Detailed Design Procedure
        1. 11.2.2.1 Programming the Output Voltage
        2. 11.2.2.2 Programming the UVLO Threshold Voltage
        3. 11.2.2.3 Inductor Selection
        4. 11.2.2.4 Capacitor Selection
          1. 11.2.2.4.1 Input Capacitor
          2. 11.2.2.4.2 Output Capacitor
          3. 11.2.2.4.3 Capacitor at VAUX
      3. 11.2.3 Application Curves
    3. 11.3 System Examples
  12. 12Power Supply Recommendations
  13. 13Layout
    1. 13.1 Layout Guidelines
    2. 13.2 Layout Example
    3. 13.3 Thermal Considerations
  14. 14器件和文档支持
    1. 14.1 相关链接
    2. 14.2 商标
    3. 14.3 静电放电警告
    4. 14.4 术语表
  15. 15机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

5 修订历史记录

Changes from D Revision (March 2013) to E Revision

  • Added ESD 额定值表，特性 描述部分，器件功能模式，应用和实施部分，电源相关建议部分，布局部分，器件和文档支持部分以及机械、封装和可订购信息部分Go

Changes from C Revision (September 2012) to D Revision

  • Changed the PS pin description From: Enable/disable Power Save mode (High = enabled, Low = disabled) To: Enable/disable Power Save mode (High = disabled, Low = enabled)Go

Changes from B Revision (FEBRUARY 2008) to C Revision

  • 已将特性从“小型 3mm x 3mm QFN-10 封装”改为“小型 3mm x 3mm SON-10 封装”Go
  • 将应用从：白光 LED 改为：白光 LED 驱动器Go
  • Changed the Available Device Options Package type From: 10-PIN QFN To: 10-Pin SONGo
  • Changed VSS to VIN in the Recommended Operating Conditions tableGo
  • Changed From: DISSIPATION RATINGS TABLE To: Thermal Information table Go
  • Changed the Parameters and Test Conditions in the Electrical Characteristics table Go
  • Updated Figure 1 through Figure 11Go
  • Added C3 to the List of ComponentsGo
  • Added text to the Input Capacitor section "An R-C filter may be placed..."Go
  • Added Figure 26, Figure 27, and Figure 28Go
  • Added Figure 29Go

Changes from A Revision (JUNE 2007) to B Revision

  • Added DSC package and tape and reel note to the Available Device Options.Go

Changes from * Revision (MARCH 2007) to A Revision

  • Changed 特性 要点从“600mA 输出电流，3.3V (VIN ≥ 1.2V) 时”改为“300mA 输出电流，3.3V (VIN ≥ 2.4V) 时”Go
  • Changed Figure 6 label From: Power Save Disabled To: Power Save Enabled Go
  • Changed Figure 7 label From: Power Save Enabled To: Power Save Disabled Go
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