ZHCSFD9B July   2016  – October 2018 TPS61230A

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
    1.     Device Images
      1.      典型应用
      2.      效率
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Startup
      2. 7.3.2 Enable and Disable
      3. 7.3.3 Under-Voltage Lockout (UVLO)
      4. 7.3.4 Current Limit Operation
      5. 7.3.5 Over Voltage Protection
      6. 7.3.6 Load Disconnect
      7. 7.3.7 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 PWM Mode
      2. 7.4.2 PFM Mode
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 TPS61230A 2.5-V to 4.5-V Input, 5-V Output Converter
        1. 8.2.1.1 TPS61230A 5-V Output Design Requirements
        2. 8.2.1.2 TPS61230A 5-V Detailed Design Procedure
          1. 8.2.1.2.1 Programming The Output Voltage
          2. 8.2.1.2.2 Inductor and Capacitor Selection
            1. 8.2.1.2.2.1 Inductor Selection
            2. 8.2.1.2.2.2 Output Capacitor Selection
            3. 8.2.1.2.2.3 Input Capacitor Selection
          3. 8.2.1.2.3 Loop Stability, Feed Forward Capacitor
        3. 8.2.1.3 TPS61230A 5-V Output Application Performance Plots
      2. 8.2.2 Systems Example - TPS61230A with Feed Forward Capacitor for Best Transient Response
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 Thermal Considerations
  11. 11器件和文档支持
    1. 11.1 器件支持
      1. 11.1.1 第三方米6体育平台手机版_好二三四免责声明
    2. 11.2 文档支持
      1. 11.2.1 相关文档
    3. 11.3 接收文档更新通知
    4. 11.4 社区资源
    5. 11.5 商标
    6. 11.6 静电放电警告
    7. 11.7 术语表
  12. 12机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

6.4 Thermal Information

THERMAL METRIC(1) TPS61230A TPS61230A UNIT
RNS 7 PINS (VQFN) RNS 7 PINS (VQFN)
Standard EVM(2)
RθJA Junction-to-ambient thermal resistance (no vias) 93 60.0 °C/W
RθJA Junction-to-ambient thermal resistance (with vias underneath) 56 °C/W
RθJB Junction-to-board thermal resistance 28.4 N/A(3) °C/W
RθJC Junction-to-case thermal resistance 57.8 N/A(3) °C/W
ψJT Junction-to-top characterization parameter 2.0 1.9 °C/W
ψJB Junction-to-board characterization parameter 28.1 27.7 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.
(2) Measured on the evaluation module (EVM PWR767A), 2-layer 50mm × 63mm PCB (2 oz on all layers).
(3) N/A - Dose not apply for EVM configuration.
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