11.3 Thermal Considerations

Implementation of integrated circuits in low-profile and fine-pitch surface-mount packages typically requires special attention to power dissipation. Many system-dependent issues such as thermal coupling, airflow, added heat sinks and convection surfaces, and the presence of other heat-generating components affect the power-dissipation limits of a given component.

Three basic approaches for enhancing thermal performance are listed below.

• Improving the power dissipation capability of the PCB design
• Improving the thermal coupling of the component to the PCB by soldering the Exposed Thermal Pad
• Introducing airflow in the system

For more details on how to use the thermal parameters in the dissipation ratings table, please check the Thermal Characteristics of Linear and Logic Packages Using JEDEC PCB Designs Application Report (SZZA017) and the Semiconductor and IC Package Thermal Metrics Application Report (SPRA953).