ZHCSLA4E May   2020  – October 2024 TPS61378-Q1

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  VCC Power Supply
      2. 7.3.2  Input Undervoltage Lockout (UVLO)
      3. 7.3.3  Enable and Soft Start
      4. 7.3.4  Shut Down
      5. 7.3.5  Switching Frequency Setting
      6. 7.3.6  Spread Spectrum Frequency Modulation
      7. 7.3.7  Adjustable Peak Current Limit
      8. 7.3.8  Bootstrap
      9. 7.3.9  Load Disconnect
      10. 7.3.10 MODE/SYNC Configuration
      11. 7.3.11 Overvoltage Protection (OVP)
      12. 7.3.12 Output Short Protection/Hiccup
      13. 7.3.13 Power-Good Indicator
      14. 7.3.14 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Forced PWM Mode
      2. 7.4.2 Auto PFM Mode
      3. 7.4.3 External Clock Synchronization
      4. 7.4.4 Down Mode
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Programming the Output Voltage
        2. 8.2.2.2 Setting the Switching Frequency
        3. 8.2.2.3 Setting the Current Limit
        4. 8.2.2.4 Selecting the Inductor
        5. 8.2.2.5 Selecting the Output Capacitors
        6. 8.2.2.6 Selecting the Input Capacitors
        7. 8.2.2.7 Loop Stability and Compensation
          1. 8.2.2.7.1 Small Signal Model
          2. 8.2.2.7.2 Loop Compensation Design Steps
          3. 8.2.2.7.3 Selecting the Bootstrap Capacitor
          4. 8.2.2.7.4 VCC Capacitor
      3. 8.2.3 Application Curves
  10. 9 Power Supply Recommendations
  11. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  12. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 第三方米6体育平台手机版_好二三四免责声明
    2. 11.2 接收文档更新通知
    3. 11.3 支持资源
    4. 11.4 Trademarks
    5. 11.5 术语表
    6. 11.6 静电放电警告
  13. 12Revision History
  14. 13Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

11.5 术语表

    TI 术语表 本术语表列出并解释了术语、首字母缩略词和定义。
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