ZHCSJN0B April   2019  – October 2019 TPS61390

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
    1.     Device Images
      1.      典型应用电路
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Recommended Operating Conditions
    2. 6.2 Absolute Maximum Ratings
    3. 6.3 ESD Ratings
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Undervoltage Lockout
      2. 7.3.2 Enable and Disable
      3. 7.3.3 Current Mirror
      4. 7.3.4 Sample and Hold
      5. 7.3.5 High Optical Power Protection
    4. 7.4 Device Functional Mode
      1. 7.4.1 PFM Operation
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirement
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1  Selecting the Rectifier Diode
        2. 8.2.2.2  Selecting the Inductor
        3. 8.2.2.3  Selecting Output Capacitor
        4. 8.2.2.4  Selecting Filter Resistor and Capacitor
        5. 8.2.2.5  Setting the Output Voltage
        6. 8.2.2.6  Selecting Sample Window
        7. 8.2.2.7  Selecting Capacitor for CAP pin
        8. 8.2.2.8  Selecting Capacitor for AVCC pin
        9. 8.2.2.9  Selecting Capacitor for APD pin
        10. 8.2.2.10 Selecting the Resistors of MON1 or MON2
        11. 8.2.2.11 Selecting the Capacitors of MON1 or MON2
        12. 8.2.2.12 Selecting the Resistor of Gain pin
        13. 8.2.2.13 Selecting the Short Current Limit
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11器件和文档支持
    1. 11.1 接收文档更新通知
    2. 11.2 社区资源
    3. 11.3 商标
    4. 11.4 静电放电警告
    5. 11.5 Glossary
  12. 12机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

6.4 Thermal Information

THERMAL METRIC(1) TPS61390 UNIT
RTE (WQFN)
16 PINS
RθJA Junction-to-ambient thermal resistance 52.9 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 54.4 °C/W
RθJB Junction-to-board thermal resistance 27.9 °C/W
ΨJT Junction-to-top characterization parameter 2.0 °C/W
YJB Junction-to-board characterization parameter 27.8 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 12.8 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.
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