ZHCSJN0B April   2019  – October 2019 TPS61390

PRODUCTION DATA.  

  1. 特性
  2. 应用
  3. 说明
    1.     Device Images
      1.      典型应用电路
  4. 修订历史记录
  5. Pin Configuration and Functions
    1.     Pin Functions
  6. Specifications
    1. 6.1 Recommended Operating Conditions
    2. 6.2 Absolute Maximum Ratings
    3. 6.3 ESD Ratings
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Undervoltage Lockout
      2. 7.3.2 Enable and Disable
      3. 7.3.3 Current Mirror
      4. 7.3.4 Sample and Hold
      5. 7.3.5 High Optical Power Protection
    4. 7.4 Device Functional Mode
      1. 7.4.1 PFM Operation
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirement
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1  Selecting the Rectifier Diode
        2. 8.2.2.2  Selecting the Inductor
        3. 8.2.2.3  Selecting Output Capacitor
        4. 8.2.2.4  Selecting Filter Resistor and Capacitor
        5. 8.2.2.5  Setting the Output Voltage
        6. 8.2.2.6  Selecting Sample Window
        7. 8.2.2.7  Selecting Capacitor for CAP pin
        8. 8.2.2.8  Selecting Capacitor for AVCC pin
        9. 8.2.2.9  Selecting Capacitor for APD pin
        10. 8.2.2.10 Selecting the Resistors of MON1 or MON2
        11. 8.2.2.11 Selecting the Capacitors of MON1 or MON2
        12. 8.2.2.12 Selecting the Resistor of Gain pin
        13. 8.2.2.13 Selecting the Short Current Limit
      3. 8.2.3 Application Curves
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11器件和文档支持
    1. 11.1 接收文档更新通知
    2. 11.2 社区资源
    3. 11.3 商标
    4. 11.4 静电放电警告
    5. 11.5 Glossary
  12. 12机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

静电放电警告

esds-image

ESD 可能会损坏该集成电路。米6体育平台手机版_好二三四 (TI) 建议通过适当的预防措施处理所有集成电路。如果不遵守正确的处理措施和安装程序 , 可能会损坏集成电路。

ESD 的损坏小至导致微小的性能降级 , 大至整个器件故障。 精密的集成电路可能更容易受到损坏 , 这是因为非常细微的参数更改都可能会导致器件与其发布的规格不相符。