As for all switching power supplies, the layout is an important step in the design. The input capacitor must be placed as close as possible to the IC pins.

Provide a low inductance, impedance ground, and supply path. Therefore, use wide and short traces for the main current paths. Connect the AGND and PGND pins of the device to the thermal pad land of the PCB and use this pad as a star point. Use a common power PGND node and a different node for the signal AGND to minimize the effects of ground noise. The FB divider network must be connected right to the output capacitor and the FB line must be routed away from noisy components and traces (for example, SW line).

Due to the small package of this converter and the overall small design size, the thermal performance of the PCB layout is important. To get a good thermal performance, a four or more layer PCB design is recommended. The PowerPAD of the IC must be soldered on the thermal pad area on the PCB to get a proper thermal connection. For good thermal performance, the exposed pad on the PCB must be connected to an inner GND plane with sufficient via connections. Refer to the documentation of the evaluation kit.