ZHCSHS6F November   2017  – November 2024

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Device Options
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings 
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information 
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Power Save Mode
      2. 7.3.2 Pulse Width Modulation (PWM) Operation
      3. 7.3.3 100% Duty Cycle Low Dropout Operation
      4. 7.3.4 Soft Start
      5. 7.3.5 Switch Current Limit and HICCUP Short-Circuit Protection
      6. 7.3.6 Undervoltage Lockout
      7. 7.3.7 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Enable and Disable
      2. 7.4.2 Power Good
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Custom Design With WEBENCH® Tools
        2. 8.2.2.2 Setting The Output Voltage
        3. 8.2.2.3 Feedforward Capacitor
        4. 8.2.2.4 Output Filter Design
        5. 8.2.2.5 Inductor Selection
        6. 8.2.2.6 Capacitor Selection
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
        1. 8.4.2.1 Thermal Considerations
  10. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 第三方米6体育平台手机版_好二三四免责声明
      2. 9.1.2 Development Support
        1. 9.1.2.1 Custom Design With WEBENCH® Tools
    2. 9.2 Documentation Support
      1. 9.2.1 Related Documentation
    3. 9.3 接收文档更新通知
    4. 9.4 支持资源
    5. 9.5 Trademarks
    6. 9.6 静电放电警告
    7. 9.7 术语表
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • YFP|6
散热焊盘机械数据 (封装 | 引脚)

6.4 Thermal Information 

THERMAL METRIC(1) TPS62088/TPS6208xA UNIT
6 PINS
YFP (6 PINS) YWC (6 PINS) YFP EVM-814 YWC EVM-084
RθJA Junction-to-ambient thermal resistance 141.3 130.9 85.7 70.6 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 1.7 1.1 n/a (2) n/a (2) °C/W
RθJB Junction-to-board thermal resistance 47.3 27.3 n/a (2) n/a (2) °C/W
ψJT Junction-to-top characterization parameter 0.5 0.7 1.9 0.5 °C/W
ψJB Junction-to-board characterization parameter 47.5 27.2 55.9 38.7 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.
(2) Not applicable to an EVM.
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