ZHCSBE5C August   2013  – November 2021 TPS62090-Q1

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Enable and Disable (EN)
      2. 7.3.2  Soft Start (SS) and Hiccup Current Limit During Start-Up
      3. 7.3.3  Voltage Tracking (SS)
      4. 7.3.4  Short-Circuit Protection (Hiccup Mode)
      5. 7.3.5  Output Discharge Function
      6. 7.3.6  Power Good Output (PG)
      7. 7.3.7  Frequency Set Pin (FREQ)
      8. 7.3.8  Undervoltage Lockout (UVLO)
      9. 7.3.9  Thermal Shutdown
      10. 7.3.10 Charge Pump (CP, CN)
    4. 7.4 Device Functional Modes
      1. 7.4.1 Pulse Width Modulation Operation
      2. 7.4.2 Power Save Mode Operation
      3. 7.4.3 Low-Dropout Operation (100% Duty Cycle)
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Inductor Selection
        2. 8.2.2.2 Input and Output Capacitor Selection
        3. 8.2.2.3 Setting the Output Voltage
      3. 8.2.3 Application Curves
    3. 8.3 System Examples
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 第三方米6体育平台手机版_好二三四免责声明
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 接收文档更新通知
    4. 11.4 支持资源
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 术语表
  12. 12Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

6.4 Thermal Information

THERMAL METRIC(1)TPS62090-Q1UNIT
RGT (QFN)
16 PINS
RθJAJunction-to-ambient thermal resistance45.6°C/W
RθJC(top)Junction-to-case (top) thermal resistance58.9°C/W
RθJBJunction-to-board thermal resistance19°C/W
ψJTJunction-to-top characterization parameter1.1°C/W
ψJBJunction-to-board characterization parameter19°C/W
RθJC(bot)Junction-to-case (bottom) thermal resistance4°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.
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