ZHCSCI6D May 2014 – January 2018 TPS6213013A-Q1 , TPS62130A-Q1 , TPS62133A-Q1
PRODUCTION DATA.
PIN(1) | I/O | DESCRIPTION | |
---|---|---|---|
NO. | NAME | ||
1,2,3 | SW | O | Switch node, which is connected to the internal MOSFET switches. Connect inductor between SW and output capacitor. |
4 | PG | O | Output power good (High = VOUT ready, Low = VOUT below nominal regulation) ; open drain (requires pull-up resistor) |
5 | FB | I | Voltage feedback of adjustable version. Connect resistive voltage divider to this pin. It is recommended to connect FB to AGND on fixed output voltage versions for improved thermal performance. |
6 | AGND | Analog Ground. Must be connected directly to the Exposed Thermal Pad and common ground plane. | |
7 | FSW | I | Switching Frequency Select (Low=2.5MHz, High=1.25MHz for typical operation)(2) |
8 | DEF | I | Output Voltage Scaling (Low = nominal, High = nominal + 5%)(2) |
9 | SS/TR | I | Soft-Start / Tracking Pin. An external capacitor connected to this pin sets the internal voltage reference rise time. It can be used for tracking and sequencing. |
10 | AVIN | I | Supply voltage for control circuitry. Connect to same source as PVIN. |
11,12 | PVIN | I | Supply voltage for power stage. Connect to same source as AVIN. |
13 | EN | I | Enable input (High = enabled, Low = disabled)(2) |
14 | VOS | I | Output voltage sense pin and connection for the control loop circuitry. |
15,16 | PGND | Power Ground. Must be connected directly to the Exposed Thermal Pad and common ground plane. | |
Exposed Thermal Pad | – | Must be connected to AGND (pin 6), PGND (pin 15,16) and common ground plane(3). Must be soldered to achieve appropriate power dissipation and mechanical reliability. |