ZHCSFI8C June   2016  – June 2021 TPS62135

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  8. 8 Parameter Measurement Information
    1. 8.1 Schematic
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Precise Enable
      2. 9.3.2 Power Good (PG)
      3. 9.3.3 Pin-Selectable Output Voltage (VSEL and FB2)
      4. 9.3.4 MODE
      5. 9.3.5 Undervoltage Lockout (UVLO)
      6. 9.3.6 Thermal Shutdown
    4. 9.4 Device Functional Modes
      1. 9.4.1 Pulse Width Modulation (PWM) Operation
      2. 9.4.2 Power Save Mode Operation (PWM/PFM)
      3. 9.4.3 100% Duty-Cycle Operation
      4. 9.4.4 HICCUP Current Limit And Short Circuit Protection (TPS62135 only)
      5. 9.4.5 Current Limit And Short Circuit Protection (TPS621351 only)
      6. 9.4.6 Soft-Start / Tracking (SS/TR)
      7. 9.4.7 Output Discharge Function (TPS62135 only)
      8. 9.4.8 Starting into a Pre-Biased Load (TPS621351 only)
  10. 10Application and Implementation
    1. 10.1 Application Information
      1. 10.1.1 Programming the Output Voltage
      2. 10.1.2 External Component Selection
      3. 10.1.3 Inductor Selection
      4. 10.1.4 Capacitor Selection
        1. 10.1.4.1 Output Capacitor
        2. 10.1.4.2 Input Capacitor
        3. 10.1.4.3 Soft-Start Capacitor
      5. 10.1.5 Tracking Function
      6. 10.1.6 Output Filter and Loop Stability
    2. 10.2 Typical Applications
      1. 10.2.1 Typical Application with Adjustable Output Voltage
        1. 10.2.1.1 Design Requirements
        2. 10.2.1.2 Detailed Design Procedure
        3. 10.2.1.3 Application Curves
      2. 10.2.2 Typical Application using VSEL and FB2
        1. 10.2.2.1 Design Requirements
        2. 10.2.2.2 Detailed Design Procedure
        3. 10.2.2.3 Application Curves
    3. 10.3 System Examples
      1. 10.3.1 LED Power Supply
      2. 10.3.2 Powering Multiple Loads
      3. 10.3.3 Voltage Tracking
      4. 10.3.4 Precise Soft-Start Timing
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
    3. 12.3 Thermal Considerations
  13. 13Device and Documentation Support
    1. 13.1 Device Support
      1. 13.1.1 第三方米6体育平台手机版_好二三四免责声明
    2. 13.2 接收文档更新通知
    3. 13.3 支持资源
    4. 13.4 Trademarks
    5. 13.5 静电放电警告
    6. 13.6 术语表
  14. 14Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

7.4 Thermal Information

THERMAL METRIC(1)TPS62135, TPS621351UNIT
RGX (VQFN)
11 PIN
RθJAJunction-to-ambient thermal resistance38.4°C/W
RθJC(top)Junction-to-case (top) thermal resistance2.0°C/W
RθJBJunction-to-board thermal resistance7.6°C/W
ψJTJunction-to-top characterization parameter0.1°C/W
ψJBJunction-to-board characterization parameter7.6°C/W
RθJC(bot)Junction-to-case (bottom) thermal resistance3.2°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. Thermal data is taken according JEDEC 51-5 on a 4-layer pcb with 6 thermal vias.
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