11 Device and Documentation Support
11.1 Device Support
11.1.1 Third-Party Products Disclaimer
TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE.
11.1.2 Development Support
For the EVM Gerber data, see SLVC394.
11.2 Documentation Support
11.2.1 Related Documentation
For related documentation see the following:
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Optimizing the TPS62130/40/50/60/70 Output Filter, SLVA463
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Optimizing Transient Response of Internally Compensated dc-dc Converters With Feedforward Capacitor, SLVA289
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Semiconductor and IC Package Thermal Metrics, SPRA953
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Thermal Characteristics of Linear and Logic Packages Using JEDEC PCB Designs, SZZA017
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TPS62130/40/50 Sequencing and Tracking, SLVA470
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TPS62130EVM-505, TPS62140EVM-505, and TPS62150EVM-505 Evaluation Modules, SLVU437
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Using a Feedforward Capacitor to Improve Stability and Bandwidth of TPS62130/40/50/60/70, SLVA466
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Voltage Margining Using the TPS62130, SLVA489
11.3 Community Resource
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.
11.4 Trademarks
E2E is a trademark of Texas Instruments.
DCS-Control is a trademark of TI.
All other trademarks are the property of their respective owners.
11.5 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.
11.6 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.