ZHCSCG9C May 2014 – July 2019 TPS62150A-Q1 , TPS62152A-Q1 , TPS62153A-Q1
PRODUCTION DATA.
PIN(1) | I/O | DESCRIPTION | |
---|---|---|---|
NAME | NO. | ||
SW | 1,2,3 | O | Switch node, which is connected to the internal MOSFET switches. Connect inductor between SW and output capacitor. |
PG | 4 | O | Output power good (High = VOUT ready, Low = VOUT below nominal regulation) ; open drain (requires pull-up resistor) |
FB | 5 | I | Voltage feedback of adjustable version. Connect resistive voltage divider to this pin. It is recommended to connect FB to AGND on fixed output voltage versions for improved thermal performance. |
AGND | 6 | Analog Ground. Must be connected directly to the Exposed Thermal Pad and common ground plane. | |
FSW | 7 | I | Switching Frequency Select (Low=2.5MHz, High=1.25MHz for typical operation)(2) |
DEF | 8 | I | Output Voltage Scaling (Low = nominal, High = nominal + 5%)(2) |
SS/TR | 9 | I | Soft-Start / Tracking Pin. An external capacitor connected to this pin sets the internal voltage reference rise time. It can be used for tracking and sequencing. |
AVIN | 10 | I | Supply voltage for control circuitry. Connect to same source as PVIN. |
PVIN | 11,12 | I | Supply voltage for power stage. Connect to same source as AVIN. |
EN | 13 | I | Enable input (High = enabled, Low = disabled)(2) |
VOS | 14 | I | Output voltage sense pin and connection for the control loop circuitry. |
PGND | 15,16 | Power Ground. Must be connected directly to the Exposed Thermal Pad and common ground plane. | |
Exposed Thermal Pad | Must be connected to AGND (pin 6), PGND (pin 15,16) and common ground plane(3). Must be soldered to achieve appropriate power dissipation and mechanical reliability. |