ZHCS111E November 2011 – May 2017 TPS62170 , TPS62171 , TPS62172 , TPS62173
PRODUCTION DATA.
- 1 特性
- 2 应用
- 3 说明
- 4 修订历史记录
- 5 Device Voltage Options
- 6 Pin Configuration and Functions
- 7 Specifications
- 8 Detailed Description
-
9 Application and Implementation
- 9.1 Application Information
- 9.2
Typical Application
- 9.2.1 Design Requirements
- 9.2.2 Detailed Design Procedure
- 9.2.3 Application Curves
- 9.3 System Examples
- 10Power Supply Recommendations
- 11Layout
- 12器件和文档支持
- 13机械、封装和可订购信息
6 Pin Configuration and Functions
DSG Package
8-Pin WSON With Exposed Thermal Pad
Top View
Pin Functions
| PIN(1) | I/O | DESCRIPTION | |
|---|---|---|---|
| NAME | NO. | ||
| PGND | 1 | — | Power ground |
| VIN | 2 | IN | Supply voltage |
| EN | 3 | IN | Enable input (High = enabled, Low = disabled) |
| AGND | 4 | — | Analog ground |
| FB | 5 | IN | Voltage feedback of adjustable version. Connect resistive voltage divider to this pin. It is recommended to connect FB to AGND on fixed output voltage versions for improved thermal performance. |
| VOS | 6 | IN | Output voltage sense pin and connection for the control loop circuitry. |
| SW | 7 | OUT | Switch node, which is connected to the internal MOSFET switches. Connect inductor between SW and output capacitor. |
| PG | 8 | OUT | Output power good (High = VOUT ready, Low = VOUT below nominal regulation); open drain (requires pull-up resistor; goes high impedance, when device is switched off) |
| Exposed Thermal Pad | — | Must be connected to AGND. Must be soldered to achieve appropriate power dissipation and mechanical reliability. | |
(1) For more information about connecting pins, see Detailed Description and Application Information sections.