ZHCSPB1B November   2021  – July 2022 TPS62441-Q1 , TPS62442-Q1

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
    7. 7.7 Typical Characteristics
  8. 8 Parameter Measurement Information
    1. 8.1 Schematic
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Precise Enable (EN)
      2. 9.3.2 COMP/FSET
      3. 9.3.3 MODE/SYNC
      4. 9.3.4 Spread Spectrum Clocking (SSC)
      5. 9.3.5 Undervoltage Lockout (UVLO)
      6. 9.3.6 Power-Good Output (PG)
      7. 9.3.7 Thermal Shutdown
    4. 9.4 Device Functional Modes
      1. 9.4.1 Pulse Width Modulation (PWM) Operation
      2. 9.4.2 Power Save Mode Operation (PWM and PFM)
      3. 9.4.3 100% Duty-Cycle Operation
      4. 9.4.4 Current Limit and Short Circuit Protection
      5. 9.4.5 Foldback Current Limit and Short Circuit Protection
      6. 9.4.6 Output Discharge
      7. 9.4.7 Soft Start
  10. 10Application and Implementation
    1. 10.1 Application Information
      1. 10.1.1 Programming the Output Voltage
      2. 10.1.2 External Component Selection
        1. 10.1.2.1 Inductor Selection
        2. 10.1.2.2 Capacitor Selection
          1. 10.1.2.2.1 Input Capacitor
          2. 10.1.2.2.2 Output Capacitor
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
      3. 10.2.3 Application Curves
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Device Support
      1. 13.1.1 第三方米6体育平台手机版_好二三四免责声明
    2. 13.2 Documentation Support
      1. 13.2.1 Related Documentation
    3. 13.3 接收文档更新通知
    4. 13.4 支持资源
    5. 13.5 Trademarks
    6. 13.6 Electrostatic Discharge Caution
    7. 13.7 术语表
  14. 14Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

7.4 Thermal Information

THERMAL METRIC(1)  (JEDEC)  (EVM) UNIT
14 PINS 14 PINS
RθJA Junction-to-ambient thermal resistance 68.7 53.9 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 50.8 n/a °C/W
RθJB Junction-to-board thermal resistance 15.1 n/a °C/W
ΨJT Junction-to-top characterization parameter 3.5 1.9 °C/W
ΨJB Junction-to-board characterization parameter 14.9 20.1 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance n/a n/a °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.
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