ZHCSNO6B February   2023  – March 2024 TPS628301 , TPS628302 , TPS628303 , TPS628304

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Device Options
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information Discrete
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Pulse Width Modulation (PWM) Operation
      2. 7.3.2 Power Save Mode (PSM) Operation
      3. 7.3.3 Start-Up and Soft Start
      4. 7.3.4 Switch Cycle-by-Cycle Current Limit
      5. 7.3.5 Short-Circuit Protection
      6. 7.3.6 Undervoltage Lockout
      7. 7.3.7 Thermal Shutdown
      8. 7.3.8 Optimized EMI Performance
    4. 7.4 Device Functional Modes
      1. 7.4.1 Enable, Disable, and Output Discharge
      2. 7.4.2 Minimum Duty Cycle and 100% Mode Operation
      3. 7.4.3 Power Good
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Custom Design With WEBENCH® Tools
        2. 8.2.2.2 Setting The Output Voltage
        3. 8.2.2.3 Inductor Selection
        4. 8.2.2.4 Output Capacitor Selection
        5. 8.2.2.5 Input Capacitor Selection
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
        1. 8.4.2.1 Thermal Considerations
  10. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 第三方米6体育平台手机版_好二三四免责声明
      2. 9.1.2 Development Support
        1. 9.1.2.1 Custom Design With WEBENCH® Tools
    2. 9.2 Documentation Support
      1. 9.2.1 Related Documentation
    3. 9.3 支持资源
    4. 9.4 Trademarks
    5. 9.5 静电放电警告
    6. 9.6 术语表
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

6.4 Thermal Information Discrete

THERMAL METRIC(1) TPS62830xRZE TPS62830xDRL UNIT
8 pin-WQFN 8 pin-SOT583
JEDEC EVM JEDEC EVM
RθJA Junction-to-ambient thermal resistance 105.7 77.6 110.9 80 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 90.9 n/a(2) 41.4 n/a(2) °C/W
RθJB Junction-to-board thermal resistance 30.7 n/a(2) 22.2 n/a(2) °C/W
ψJT Junction-to-top characterization parameter 2.7 2.8 0.8 1.3 °C/W
ψJB Junction-to-board characterization parameter 30.7 44.7 22.1 28.2 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics report.
(2) Not applicable to an EVM.
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