ZHCSLC8K May   2020  – June 2024 TPS628501-Q1 , TPS628502-Q1 , TPS628503-Q1

PRODMIX  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  8. 7 Parameter Measurement Information
    1. 7.1 Schematic
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Precise Enable (EN)
      2. 8.3.2 COMP/FSET
      3. 8.3.3 MODE / SYNC
      4. 8.3.4 Spread Spectrum Clocking (SSC)
      5. 8.3.5 Undervoltage Lockout (UVLO)
      6. 8.3.6 Power-Good Output (PG)
      7. 8.3.7 Thermal Shutdown
    4. 8.4 Device Functional Modes
      1. 8.4.1 Pulse Width Modulation (PWM) Operation
      2. 8.4.2 Power Save Mode Operation (PWM/PFM)
      3. 8.4.3 100% Duty-Cycle Operation
      4. 8.4.4 Current Limit and Short Circuit Protection
      5. 8.4.5 Foldback Current Limit and Short-Circuit Protection
      6. 8.4.6 Output Discharge
      7. 8.4.7 Input Overvoltage Protection
  10. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Programming the Output Voltage
      2. 9.1.2 External Component Selection
        1. 9.1.2.1 Inductor Selection
      3. 9.1.3 Capacitor Selection
        1. 9.1.3.1 Input Capacitor
        2. 9.1.3.2 Output Capacitor
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
    3. 9.3 System Examples
      1. 9.3.1 Fixed Output Voltage Versions
      2. 9.3.2 Synchronizing to an External Clock
    4. 9.4 Power Supply Recommendations
    5. 9.5 Layout
      1. 9.5.1 Layout Guidelines
      2. 9.5.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Device Support
      1. 10.1.1 第三方米6体育平台手机版_好二三四免责声明
    2. 10.2 接收文档更新通知
    3. 10.3 支持资源
    4. 10.4 Trademarks
    5. 10.5 静电放电警告
    6. 10.6 术语表
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

6.4 Thermal Information

THERMAL METRIC(1) TPS62850x-Q1 TPS62850x-Q1 UNIT
DRL (JEDEC)(2) DRL (EVM)
8 PINS 8 PINS
RθJA Junction-to-ambient thermal resistance 110 60 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 41.3 n/a °C/W
RθJB Junction-to-board thermal resistance 20 n/a °C/W
ΨJT Junction-to-top characterization parameter 0.8 n/a °C/W
YJB Junction-to-board characterization parameter 20 n/a °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance n/a n/a °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.
(2) JEDEC standard PCB with 4 layers, no thermal vias
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