米6体育平台手机版

ZHCSLS6B August 2020 – June 2022 TPS628510 , TPS628511 , TPS628512 , TPS628513

PRODUCTION DATA

7.4 Thermal Information

THERMAL METRIC⁽¹⁾		DRL (JEDEC)⁽²⁾	DRL (EVM)	UNIT
THERMAL METRIC⁽¹⁾		8 PINS	8 PINS	UNIT
R_θJA	Junction-to-ambient thermal resistance	110	60	°C/W
R_θJC(top)	Junction-to-case (top) thermal resistance	41.3	n/a	°C/W
R_θJB	Junction-to-board thermal resistance	20	n/a	°C/W
Ψ_JT	Junction-to-top characterization parameter	0.8	n/a	°C/W
Y_JB	Junction-to-board characterization parameter	20	n/a	°C/W
R_θJC(bot)	Junction-to-case (bottom) thermal resistance	n/a	n/a	°C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.

(2) JEDEC standard PCB with four layers, no thermal vias