ZHCSNZ3B January   2023  – May 2024 TPS62870 , TPS62871 , TPS62872 , TPS62873

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 说明（续）
  6. 5 Device Options
  7. 6 Pin Configuration and Functions
  8. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings_Catalog
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 I2C Interface Timing Characteristics
    7. 7.7 Timing Requirements
    8. 7.8 Typical Characteristics
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Fixed-Frequency DCS Control Topology
      2. 8.3.2  Forced PWM and Power Save Modes
      3. 8.3.3  Precise Enable
      4. 8.3.4  Start-Up
      5. 8.3.5  Switching Frequency Selection
      6. 8.3.6  Output Voltage Setting
        1. 8.3.6.1 Output Voltage Range
        2. 8.3.6.2 Output Voltage Setpoint
        3. 8.3.6.3 Non-Default Output Voltage Setpoint
        4. 8.3.6.4 Dynamic Voltage Scaling
      7. 8.3.7  Compensation (COMP)
      8. 8.3.8  Mode Selection and Clock Synchronization (MODE/SYNC)
      9. 8.3.9  Spread Spectrum Clocking (SSC)
      10. 8.3.10 Output Discharge
      11. 8.3.11 Undervoltage Lockout (UVLO)
      12. 8.3.12 Overvoltage Lockout (OVLO)
      13. 8.3.13 Overcurrent Protection
        1. 8.3.13.1 Cycle-by-Cycle Current Limiting
        2. 8.3.13.2 Hiccup Mode
        3. 8.3.13.3 Current Limit Mode
      14. 8.3.14 Power Good (PG)
        1. 8.3.14.1 Standalone or Primary Device Behavior
        2. 8.3.14.2 Secondary Device Behavior
      15. 8.3.15 Remote Sense
      16. 8.3.16 Thermal Warning and Shutdown
      17. 8.3.17 Stacked Operation
    4. 8.4 Device Functional Modes
      1. 8.4.1 Power-On Reset
      2. 8.4.2 Undervoltage Lockout
      3. 8.4.3 Standby
      4. 8.4.4 On
    5. 8.5 Programming
      1. 8.5.1 Serial Interface Description
      2. 8.5.2 Standard, Fast, Fast Mode Plus Protocol
      3. 8.5.3 I2C Update Sequence
      4. 8.5.4 I2C Register Reset
  10. 9 Register Map
  11. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
        1. 10.2.2.1 Selecting the Inductor
        2. 10.2.2.2 Selecting the Input Capacitors
        3. 10.2.2.3 Selecting the Compensation Resistor
        4. 10.2.2.4 Selecting the Output Capacitors
        5. 10.2.2.5 Selecting the Compensation Capacitor, CC
        6. 10.2.2.6 Selecting the Compensation Capacitor, CC2
      3. 10.2.3 Application Curves
    3. 10.3 Best Design Practices
    4. 10.4 Power Supply Recommendations
    5. 10.5 Layout
      1. 10.5.1 Layout Guidelines
      2. 10.5.2 Layout Example
  12. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 第三方米6体育平台手机版_好二三四免责声明
    2. 11.2 接收文档更新通知
    3. 11.3 支持资源
    4. 11.4 Trademarks
    5. 11.5 静电放电警告
    6. 11.6 术语表
  13. 12Revision History
  14. 13Mechanical, Packaging, and Orderable Information

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机械数据 (封装 | 引脚)
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7.3 Recommended Operating Conditions

Over operating temperature range (unless otherwise noted)
MIN NOM MAX UNIT
VIN Input voltage VIN 2.7 6 V
SDA, SCL 5
VOUT Output voltage 0.4 3.35 V or  (VIN - 1.4 V)(1) V
IOUT Output current TPS62870 6 A
TPS62871 9
TPS62872 12
TPS62873 15
L Inductance 110 330 nH
fSW ≥ 2.25 MHz and VOUT ≤ 1.675 V 55 330
CIN Input capacitance (per pin)(2) VIN 5 10 µF
COUT Output capacitance(2) 40 (3)
CPAR Parasitic capacitance VSEL, FSEL 100 pF
SYNC_OUT 20
Resistor tolerance VSEL, FSEL ±2%
TJ Operating junction temperature –40 125 °C
(1) Whichever value is lower.
(2) Effective capacitance.
(3) The maximum recommended output capacitance depends on the specific operating conditions of an application. Output capacitance values up to a few millifarad are typically possible, however.
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