ZHCSQD3A october   2022  – march 2023 TPS62992-Q1

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Mode Selection and Device Configuration MODE/S-CONF
      2. 8.3.2  Adjustable VO Operation (External Voltage Divider)
      3. 8.3.3  Selectable VO Operation (VSET and Internal Voltage Divider)
      4. 8.3.4  Soft Start and Tracking (SS/TR)
        1. 8.3.4.1 Tracking Function
      5. 8.3.5  Smart Enable with Precise Threshold
      6. 8.3.6  Power Good (PG)
      7. 8.3.7  Output Discharge Function
      8. 8.3.8  Undervoltage Lockout (UVLO)
      9. 8.3.9  Current Limit and Short-Circuit Protection
      10. 8.3.10 High Temperature Specifications
      11. 8.3.11 Thermal Shutdown
    4. 8.4 Device Functional Modes
      1. 8.4.1 Forced Pulse Width Modulation (FPWM) Operation
      2. 8.4.2 Power Save Mode Operation (Auto PFM and PWM)
      3. 8.4.3 AEE (Automatic Efficiency Enhancement)
      4. 8.4.4 100% Duty-Cycle Operation
      5. 8.4.5 Starting into a Prebiased Load
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application with Adjustable Output Voltage
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Custom Design With WEBENCH® Tools
        2. 9.2.2.2 Programming the Output Voltage
        3. 9.2.2.3 External Component Selection
          1. 9.2.2.3.1 Output Filter and Loop Stability
          2. 9.2.2.3.2 Inductor Selection
          3. 9.2.2.3.3 Capacitor Selection
            1. 9.2.2.3.3.1 Output Capacitor
            2. 9.2.2.3.3.2 Input Capacitor
            3. 9.2.2.3.3.3 Soft-Start Capacitor
      3. 9.2.3 Application Curves
        1. 9.2.3.1 Application Curves Vout = 1.8 V
        2. 9.2.3.2 Application Curves Vout = 1.2 V
        3. 9.2.3.3 Application Curves Vout = 0.6 V
    3. 9.3 Typical Application with Selectable VOUT using VSET
      1. 9.3.1 Design Requirements
      2. 9.3.2 Detailed Design Procedure
        1. 9.3.2.1 Programming the Output Voltage
      3. 9.3.3 Application Curves
        1. 9.3.3.1 Application Curves Vout = 5 V
        2. 9.3.3.2 Application Curves Vout = 3.3 V
    4. 9.4 System Examples
      1. 9.4.1 LED Power Supply
      2. 9.4.2 Powering Multiple Loads
      3. 9.4.3 Voltage Tracking
      4. 9.4.4 Inverting Buck-Boost (IBB)
    5. 9.5 Power Supply Recommendations
    6. 9.6 Layout
      1. 9.6.1 Layout Guidelines
      2. 9.6.2 Layout Example
      3. 9.6.3 Thermal Considerations
  10. 10Device and Documentation Support
    1. 10.1 Device Support
      1. 10.1.1 第三方米6体育平台手机版_好二三四免责声明
      2. 10.1.2 Development Support
        1. 10.1.2.1 Custom Design With WEBENCH® Tools
    2. 10.2 Documentation Support
      1. 10.2.1 Related Documentation
    3. 10.3 接收文档更新通知
    4. 10.4 支持资源
    5. 10.5 Trademarks
    6. 10.6 静电放电警告
    7. 10.7 术语表
  11. 11Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

7.4 Thermal Information

THERMAL METRIC(1) UNIT
VQFN (RYT)
JEDEC PCB TPS6299xEVM-xxx
RθJA Junction-to-ambient thermal resistance 97.2 73.5 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 74.4 N/A °C/W
RθJB Junction-to-board thermal resistance 25 N/A °C/W
ΨJT Junction-to-top characterization parameter 2.7 4.3 °C/W
ΨJB Junction-to-board characterization parameter 24.7 28 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.
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