ZHCSJG8I July   2010  – October 2019 TPS63020 , TPS63021

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
    1.     Device Images
      1.      简化电路原理图
      2.      效率与输出电流间的关系
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Dynamic Voltage Positioning
      2. 7.3.2 Dynamic Current Limit
      3. 7.3.3 Device Enable
      4. 7.3.4 Power Good
      5. 7.3.5 Overvoltage Protection
      6. 7.3.6 Undervoltage Lockout
      7. 7.3.7 Overtemperature Protection
    4. 7.4 Device Functional Modes
      1. 7.4.1 Soft-start and Short Circuit Protection
      2. 7.4.2 Buck-Boost Operation
      3. 7.4.3 Control Loop
      4. 7.4.4 Power Save Mode and Synchronization
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Custom Design with WEBENCH Tools
        2. 8.2.2.2 Inductor Selection
        3. 8.2.2.3 Output Capacitor Selection
        4. 8.2.2.4 Input Capacitor Selection
        5. 8.2.2.5 Bypass Capacitor
      3. 8.2.3 Setting The Output Voltage
      4. 8.2.4 Application Curves
    3. 8.3 System Examples
      1. 8.3.1 Improved Transient Response for 2 A Load Current
      2. 8.3.2 Supercapacitor Backup Power Supply With Active Cell Balancing
      3. 8.3.3 Low-Power TEC Driver
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 Thermal Considerations
  11. 11器件和文档支持
    1. 11.1 接收文档更新通知
    2. 11.2 器件支持
      1. 11.2.1 使用 WEBENCH 工具创建定制设计方案
      2. 11.2.2 第三方米6体育平台手机版_好二三四免责声明
    3. 11.3 文档支持
      1. 11.3.1 相关文档
    4. 11.4 相关链接
    5. 11.5 支持资源
    6. 11.6 商标
    7. 11.7 静电放电警告
    8. 11.8 Glossary
  12. 12机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

6.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001,
pins VIN, VINA, L1(1) 		±500 V
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001,
all other pins(1) 		±2000
Charged device model (CDM), per JEDEC specification JESD22-C101, all pins(2) ±1500
(1) JEDEC document JEP155 states that, with basic ESD control methods applied, 500 V HBM allows a safe manufacturing with proven margin.
(2) JEDEC document JEP157 states that, with basic ESD control methods applied, 250 V CDM allows a safe manufacturing.
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