10.3 Thermal Considerations

Implementation of integrated circuits in low-profile and fine-pitch surface-mount packages typically requires special attention to power dissipation. Many system-dependent issues such as thermal coupling, airflow, added heat sinks and convection surfaces, and the presence of other heat-generating components affect the power-dissipation limits of a given component.

Three basic approaches for enhancing thermal performance are listed below:

• Improving the power dissipation capability of the PCB design
• Improving the thermal coupling of the component to the PCB by soldering the exposed thermal pad
• Introducing airflow in the system

Refer to the Thermal Characteristics Application Note and the Semiconductor and IC Package Thermal Metrics Application Note for more details on how to use the thermal parameters.